AMP
147444-1
Socket,Min-Spr Au-Au Ser-1
- Erhalten Sie bis zu 90 Tage Zahlungsziele von 500+ Lieferanten
- Wiederverkaufsrabatte bis zu 40%!
Preisanfrage senden
1
Zahlungsmöglichkeiten:
Product Type Features
- Sleeve Style
- Closed
- Connector System
- Cable-to-Board
- Sealable
- No
- Connector & Contact Terminates To
- Printed Circuit Board
- Product Type
- Contact
- Profile
- Zero
Body Features
- Sealant
- No
- Sleeve Material
- Copper
- Sleeve Plating Material
- Gold
Contact Features
- Contact Base Material
- Beryllium Copper
- Contact Current Rating (Max)
- 5 A
- Contact Spring Plating Thickness
- 15 µin
- Contact Type
- Socket
- Contact Spring Plating Material
- Gold
- Socket Type
- Discrete
- Contact Transmits (Typical)
- Signal (Data)/Power
- Contact Mating Area Plating Thickness
- 30 µm
- Contact Mating Area Plating Thickness
- 30 µin
Termination Features
- Termination Method to Printed Circuit Board
- Through Hole - Press-Fit
- Termination Method to Wire & Cable
- Solder
- Insertion Method
- Hand/Semi-Automatic
Dimensions
- Socket Length
- 5.84 mm
- Socket Length
- .23 in
- Hole Size (Recommended)
- 1.02 mm
- Hole Size (Recommended)
- .04 in
- Mating Pin Diameter Range
- .33 – .51 mm
- Mating Pin Diameter Range
- .013 – .02 in
Operation/Application
- Circuit Application
- Power & Signal
Packaging Features
- Packaging Method
- Bag
- Packaging Quantity
- 2000
Other
- Spring Material
- Beryllium Copper
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