TE Connectivity
1-5120532-1
1 / 1
- Part Number
- 1-5120532-1
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Zahlungsmöglichkeiten:
Signal Characteristics
- Differential Signaling
- Yes
Packaging Features
- Packaging Method
- Tape & Reel
- Packaging Quantity
- 500
Dimensions
- Stack Height
- 9 mm
- Stack Height
- 11 mm
- Stack Height
- 14 mm
- Stack Height
- .551 in
- PCB Thickness (Recommended)
- 1.27 in
- Mating Post Length
- 4.27 mm
- Height
- 6.35 mm
- Mating Post Length
- .168 in
- Length
- 34.22 mm
- Height
- .249 in
- Tail Length
- .081 in
- Length
- 1.347 in
- Width
- 3.81 mm
- Width
- 150 in
Mechanical Attachment
- PCB Mount Retention Type
- None
- Mating Alignment
- Without
- Mating Alignment Type
- None
- PCB Mount Retention
- Without
- PCB Mount Alignment
- Without
- PCB Mount Alignment Type
- Locating Posts
- Mating Retention
- Without
Configuration Features
- Stackable
- Yes
- Number of Columns
- 32
- PCB Mount Orientation
- Vertical
- Number of Positions
- 64
- Board-to-Board Configuration
- Mezzanine
- Number of Rows
- 2
Usage Conditions
- Operating Temperature Range
- -55 – 110 °C
- Operating Temperature Range
- -67 – 230 °F
Industry Standards
- Industry Standard
- IEEE 1386
- UL Flammability Rating
- UL 94V-0
- CSA Certified
- Yes
- UL Rating
- Listed
- Agency/Standard
- CSA
- Agency/Standard
- UL
- CSA File Number
- LR7189
- UL File Number
- E28476
Contact Features
- Contact Base Material
- Phosphor Bronze
- PCB Contact Termination Area Plating Material
- Tin
- Contact Configuration
- Single Beam
- Solder Tail Contact Plating Material Finish
- Matte
- Contact Mating Area Plating Material
- Gold
- Contact Mating Area Plating Thickness
- 1.27 µm
- Contact Mating Area Plating Thickness
- 50 µin
- Contact Type
- Pin
- Contact Current Rating (Max)
- 1 A
- Underplate Material Thickness
- 1.27 µm
- Contact Layout
- Inline
- Underplate Material Thickness
- 50 µin
- PCB Contact Termination Area Plating Thickness
- 3.81 µm
- PCB Contact Termination Area Plating Thickness
- 150 µin
- Contact Plating Thickness
- 0.025–0.076
- Contact Plating Thickness
- 1.27 – 2.54
- Contact Plating Thickness
- 3.81 – 6.35
Operation/Application
- Assembly Process Feature
- Pick and Place Cover
- Pick and Place Cover
- With
- Circuit Application
- Signal
- For Use With
- Receptacle Assembly
Termination Features
- Termination Method to Printed Circuit Board
- Surface Mount
Housing Features
- Centerline (Pitch)
- 1 mm
- Centerline (Pitch)
- .039 in
- Housing Material
- Thermoplastic
- Housing Entry Style
- Top
Product Type Features
- Connector Assembly Type
- PCB Mount Header
- Connector System
- Board-to-Board
- Row-to-Row Spacing
- 1 mm
- Connector & Contact Terminates To
- Printed Circuit Board
- Series
- 1mm FH
- Connector Type
- Connector Assembly
- Boss
- No
- Product Type
- Connector
Electrical Characteristics
- Insulation Resistance
- 64 VAC
- Voltage
- 250 VAC
- Insulation Resistance
- 2 MΩ
Dokumente
Data Sheet
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