TE Connectivity
146898-1
1Fhp,64,30A/P,S,C,S09,11,14
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Additional Information
- Part Number
- 146898-1
Signal Characteristics
- Differential Signaling
- Yes
Packaging Features
- Packaging Method
- Tape & Reel
- Packaging Quantity
- 450
Dimensions
- Stack Height
- 9 mm
- Stack Height
- 11 mm
- Stack Height
- 14 mm
- Stack Height
- .551 in
- PCB Thickness (Recommended)
- .76 in
- Height
- 7.35 mm
- Mating Post Length
- 2 mm
- Height
- .289 in
- Width
- 3.81 mm
- Width
- 150 in
- Length
- 34.22 mm
- Tail Length
- .081 in
- Length
- 1.347 in
Mechanical Attachment
- PCB Mount Retention Type
- None
- Mating Alignment
- Without
- Mating Alignment Type
- None
- PCB Mount Retention
- Without
- PCB Mount Alignment
- With
- PCB Mount Alignment Type
- Locating Posts
- Mating Retention
- Without
Configuration Features
- Stackable
- Yes
- Number of Columns
- 32
- PCB Mount Orientation
- Vertical
- Number of Positions
- 64
- Board-to-Board Configuration
- Mezzanine
- Number of Rows
- 2
Usage Conditions
- Operating Temperature Range
- -55 – 110 °C
- Operating Temperature Range
- -67 – 230 °F
Industry Standards
- Industry Standard
- IEEE 1386
- UL Flammability Rating
- UL 94V-0
- UL File Number
- E28476
- Agency/Standard
- CSA
- Agency/Standard
- UL
- UL Rating
- Listed
- CSA File Number
- LR7189
- CSA Certified
- Yes
Contact Features
- Contact Base Material
- Phosphor Bronze
- PCB Contact Termination Area Plating Material
- Tin-Lead
- Contact Configuration
- Single Beam
- Contact Mating Area Plating Material
- Gold
- Contact Mating Area Plating Thickness
- .76 µm
- Contact Current Rating (Max)
- 1 A
- Contact Mating Area Plating Thickness
- 29.9212 µin
- Tin to Lead Ratio
- 93 / 7
- Underplate Material Thickness
- 1.27 µm
- Contact Layout
- Inline
- Underplate Material Thickness
- 50 µin
- PCB Contact Termination Area Plating Thickness
- 3.81 µm
- Contact Plating Thickness
- .025 – .076
- PCB Contact Termination Area Plating Thickness
- 150 µin
- Contact Plating Thickness
- .127 – .254
- Contact Plating Thickness
- 2
Operation/Application
- Assembly Process Feature
- Pick and Place Cover
- Pick and Place Cover
- With
Termination Features
- Termination Method to Printed Circuit Board
- Surface Mount
Housing Features
- Centerline (Pitch)
- 1 mm
- Centerline (Pitch)
- .039 in
- Housing Material
- LCP (Liquid Crystal Polymer)
- Housing Entry Style
- Top
Product Type Features
- Connector Assembly Type
- PCB Mount Header
- Connector System
- Board-to-Board
- Row-to-Row Spacing
- 1 mm
- Connector & Contact Terminates To
- Printed Circuit Board
- Connector Type
- Connector Assembly
- Product Type
- Connector
- Boss
- Yes
- Series
- 1mm FH
Electrical Characteristics
- Voltage
- 250 VAC
- Insulation Resistance
- 64 VAC
- Insulation Resistance
- 2 MΩ
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