TE Connectivity
1926720-2
Assyminipakhdl2P15S2P Raplugbdlk
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Additional Information
- Part Number
- 1926720-2
Other
- For Use With
- Receptacle Housing
Packaging Features
- Packaging Method
- Box & Tray
- Packaging Method
- Box
- Packaging Quantity
- 56
Dimensions
- Height
- 8 mm
- Height
- .315 in
- PCB Thickness (Recommended)
- .055 mm
- PCB Thickness (Recommended)
- 1.4 in
- Width
- 26.5 mm
- Width
- 1.043 in
- Length
- 33.21 mm
- Length
- 1.31 in
Mechanical Attachment
- PCB Mount Retention Type
- Boardlock
- PCB Mount Retention
- With
- PCB Mount Alignment
- With
- Connector Mounting Type
- Board Mount
- PCB Mount Alignment Type
- Boardlock
- Mating Alignment
- With
- Mating Alignment Type
- Passive Guide
- Mating Retention
- Without
Configuration Features
- Selectively Loaded
- Yes
- Number of Positions
- 39
- PCB Mount Orientation
- Right Angle
- Number of Power Positions
- 2
- Number of Power Positions
- 4
- Number of Signal Positions
- 15
- Number of Rows
- 5
- Row-to-Row Spacing
- .079 mm
- Row-to-Row Spacing
- 2 in
- Board-to-Board Configuration
- Co-Planar
- Mating & Unmating Configuration
- Make First / Break Last
Usage Conditions
- Operating Temperature Range
- -40 – 125 °C
- Operating Temperature Range
- -40 – 257 °F
Industry Standards
- Glow Wire Rating
- Standard Part - Not Glow Wire
- CSA Rating
- Certified
- UL Rating
- Recognized
- Agency/Standard Number
- E28476
- Agency/Standard
- CSA
- Agency/Standard
- UL
Contact Features
- Contact Base Material
- Copper Alloy
- Contact Base Material
- Phosphor Bronze
- Contact Underplating Material
- Nickel
- Contact Current Rating (Max)
- 16 A
- Contact Current Rating (Max)
- 22 A
- Contact Retention
- With
- Contact Termination Area Plating Material
- Tin
- Contact Mating Area Plating Material
- Gold
- Contact Mating Area Plating Thickness
- .76 µm
- Contact Layout
- Matrix
- Contact Mating Area Plating Thickness
- 30 µin
- Underplate Material Thickness
- 1.27 µm
- Underplate Material Thickness
- 50 µin
- Contact Termination Area Plating Thickness
- .5 µm
- Contact Termination Area Plating Thickness
- 19.685 µin
- Contact Termination Area Plating Thickness
- 20 µin
- Contact Design
- Single Beam
Operation/Application
- Circuit Application
- Power & Signal
Termination Features
- Termination Method to Printed Circuit Board
- Through Hole - Press-Fit
- Termination Method to Printed Circuit Board
- Through Hole - Solder
- Termination Post &Tail Length
- 3.3 mm
- Termination Post &Tail Length
- .13 in
Housing Features
- Centerline (Pitch)
- 2.75 mm
- Centerline (Pitch)
- .079 in
- Centerline (Pitch)
- .108 in
- UL Flammability Rating
- UL 94V-0
- Housing Color
- Black
- Housing Material
- Thermoplastic
- Housing Style
- Low Profile
Product Type Features
- Product Type
- Header
- Housing Type
- Plug
- Connector System
- Board-to-Board
- Sealable
- No
- Connector & Contact Terminates To
- Printed Circuit Board
- Contact Type
- Pin
Electrical Characteristics
- Operating Voltage
- 250 VAC
- Operating Voltage
- 250 VDC
- Dielectric Withstanding Voltage
- 2500 VDC
- Dielectric Withstanding Voltage
- 700 VDC
- Insulation Resistance
- 1000 MΩ
Dokumente
Data Sheet
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