TE Connectivity
2-1658438-2
1 / 1
- Part Number
- 2-1658438-2
- Erhalten Sie bis zu 90 Tage Zahlungsziele von 500+ Lieferanten
- Wiederverkaufsrabatte bis zu 40%!
Preisanfrage senden
1
Zahlungsmöglichkeiten:
Other
- Comment
- Use of stand offs recommended. Contact Product Engineering for recommendations.
Packaging Features
- Packaging Method
- Box & Tray
- Packaging Method
- Tray
- Packaging Quantity
- 40
Dimensions
- Stack Height
- 14 mm
- PCB Thickness (Recommended)
- .25 in
- Stack Height
- .551 in
- Height
- 13.39 mm
- Height
- .526227 in
Mechanical Attachment
- Mating Alignment
- With
- Mating Alignment Type
- Guide Post
- PCB Mount Retention
- Without
- PCB Mount Alignment
- With
- Connector Mounting Type
- Board Mount
- PCB Mount Alignment Type
- Locating Posts
Configuration Features
- Selectively Loaded
- Fully Loaded
- Stackable
- No
- PCB Mount Orientation
- Vertical
- Number of Positions
- 80
- Board-to-Board Configuration
- Vertical
- Number of Rows
- 2
Usage Conditions
- Operating Temperature Range
- -65 – 125 °C
- Operating Temperature Range
- -85 – 257 °F
Contact Features
- Contact Base Material
- Phosphor Bronze
- PCB Contact Termination Area Plating Material
- Gold
- Contact Configuration
- Single Beam
- Contact Shape
- Square
- Contact Mating Area Plating Material
- Select Gold Flash
- Contact Mating Area Plating Thickness
- .25 µm
- Contact Mating Area Plating Thickness
- 9.8425 µin
- Contact Type
- Pin
- Contact Current Rating (Max)
- 1.25 A
- Contact Current Rating (Max)
- 9.5 A
- PCB Contact Termination Area Plating Thickness
- .25 µm
- Ground Contact Material
- Phosphor Bronze
- PCB Contact Termination Area Plating Thickness
- 9.8425 µin
Operation/Application
- Assembly Process Feature
- None
- Pick and Place Cover
- Without
- Circuit Application
- Signal
- For Use With
- Receptacle Assembly
Termination Features
- Termination Method to Printed Circuit Board
- Surface Mount
Body Features
- Busbar Mating Area Plating Thickness
- 675
- Cover Material
- Polyamide
Housing Features
- Centerline (Pitch)
- .8 mm
- Centerline (Pitch)
- .031 in
- Housing Material
- LCP (Liquid Crystal Polymer)
Product Type Features
- Connector Assembly Type
- PCB Mount Header
- Connector System
- Board-to-Board
- Row-to-Row Spacing
- 4.73 mm
- Row-to-Row Spacing
- .185889 in
- Sealable
- No
- Connector & Contact Terminates To
- Printed Circuit Board
- Series
- MICTOR SB
- Connector Type
- Connector Assembly
- Boss
- Yes
- Product Type
- Connector
Electrical Characteristics
- Impedance
- 50 Ω
- Dielectric Withstanding Voltage
- 675 VAC
- Insulation Resistance
- 80 VAC
- Voltage
- 125 VAC
- Insulation Resistance
- 2 MΩ
Ähnliche Produkte
Andere Kategorien
AktuatorenBlöckeKabel, Rohre & SchläucheKompressorenKontrolleKupplungen & FittingsZylinder & KolbenElektronikFilterHVACIndustrie-PCs & HMIsBeleuchtungLineartechnikMotorenStromversorgungLeistungsübertragungPumpen & VentileErneuerbare energieRobotikDichtungen, Ringe & VerbinderSensoren und MessgeräteWerkzeuge und ZubehörCNCSonstiges