TE Connectivity
2-2013266-3
1 / 1
- Part Number
- 2-2013266-3
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Preisanfrage senden
1
Zahlungsmöglichkeiten:
Other
- Comment
- With LED Position.
Packaging Features
- Packaging Method
- Tray, Tray/Box
- Packaging Quantity
- 64
Dimensions
- Height above PC Board
- 23.1 mm [ .9 in ]
- Center Retention Hole Diameter
- 1.8 mm [ .07 in ]
Mechanical Attachment
- Locating Posts
- With
- Polarization
- Left
- Mounting Angle
- Vertical
- PCB Mount Retention Type
- Solder Tail (Pin)
- PCB Mounting Style
- Through Hole
- PCB Mount Retention
- With
Configuration Features
- Number of Bays
- 2
- Center Key
- Offset Left
- Number of Rows
- 2
- Number of Keys
- 1
- Module Orientation
- Vertical
- Number of Positions
- 240
- Keying
- Standard
Industry Standards
- UL Flammability Rating
- UL 94V-0
Contact Features
- Contact Mating Area Plating Material
- Gold
- Socket Style
- DIMM
- Solder Tail Contact Plating Material
- Tin-Lead
- Socket Type
- Memory Card
- Contact Mating Area Plating Thickness
- .76 µm [ 30 µin ]
- Solder Tail Contact Plating Thickness
- 2.54 µm [ 100 µin ]
- Contact Base Material
- Copper Alloy
Termination Features
- Termination Post Length
- 2.4 mm [ .094 in ]
- Insertion Style
- Direct Insert
Body Features
- Retention Post Location
- Both Ends
- Ejector Location
- Both Ends
- Ejector Material
- High Temperature Thermoplastic
- Latch Material
- High Temperature Thermoplastic
- Ejector Type
- Standard
- Ejector Material Color
- Amber
- Module Key Type
- Offset Left
- Latch Color
- Amber
Housing Features
- Centerline
- 1 mm [ .039 in ]
- Housing Material
- High Temperature Nylon
- Housing Color
- Black
Product Type Features
- Row-to-Row Spacing
- 1.9 mm [ .075 in ]
- DRAM Type
- Double Data Rate (DDR) 3
- Center Post
- Without
- Applies To
- Printed Circuit Board
- Product Type
- Socket
Electrical Characteristics
- DRAM Voltage (V)
- 1.5
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