1 / 1
thumbnail
Part Number
2309412-3
  • Erhalten Sie bis zu 90 Tage Zahlungsziele von 500+ Lieferanten
  • Wiederverkaufsrabatte bis zu 40%!
Sign-Up
Preisanfrage senden
1
Zahlungsmöglichkeiten:
Fordern Sie ein Angebot an und wir senden Ihnen Informationen zu Verfügbarkeit und Preis.

Signal Characteristics

SGRAM Voltage
1.2 V

Packaging Features

Packaging Method
Tape & Reel
Packaging Quantity
500

Dimensions

Stack Height
8 mm
Stack Height
.315 in

Mechanical Attachment

PCB Mount Retention Type
Solder Peg
PCB Mount Retention
With
PCB Mounting Style
Surface Mount
Connector Mounting Type
Board Mount

Configuration Features

Module Orientation
Right Angle
Number of Positions
260
Number of Rows
2
Keying
Reverse
Number of Keys
1
Center Key
Offset Right

Usage Conditions

Operating Temperature Range
-55 – 85 °C
Operating Temperature Range
-67 – 185 °F

Industry Standards

UL Flammability Rating
UL 94V-0

Contact Features

Contact Base Material
Copper Alloy
PCB Contact Termination Area Plating Material
Gold Flash
Contact Underplating Material
Nickel
Contact Mating Area Plating Material
Gold
Contact Mating Area Plating Thickness
.254 µm
Contact Current Rating (Max)
.5 A
Contact Mating Area Plating Thickness
10 µin
Socket Type
Memory Card
Socket Style
SO DIMM

Operation/Application

Circuit Application
Power

Termination Features

Insertion Style
Cam-In

Body Features

Ejector Type
Locking
Module Key Type
Offset Right
Retention Post Location
Both Ends
Latch Material
High Temperature Thermoplastic
Ejector Location
Both Ends
Retention Post Material
Stainless Steel

Housing Features

Centerline (Pitch)
.5 mm
Centerline (Pitch)
.0197 in
Housing Material
High Temperature Thermoplastic
Housing Color
Black

Product Type Features

DRAM Type
Small Outline (SO)
Connector System
Cable-to-Board
Profile
High
Row-to-Row Spacing
8.2 mm
Sealable
No
Row-to-Row Spacing
.322 in
Connector & Contact Terminates To
Printed Circuit Board
Center Post
Without
Product Type
Socket

Electrical Characteristics

DRAM Voltage
1.2 V