TE Connectivity
2309413-4
Ddr4 Sodimm 260P 9.2H Std
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Additional Information
- Part Number
- 2309413-4
Signal Characteristics
- SGRAM Voltage
- 1.2 V
Packaging Features
- Packaging Method
- Tape & Reel
- Packaging Quantity
- 500
Dimensions
- Stack Height
- 9.2 mm
- Stack Height
- .362 in
Mechanical Attachment
- PCB Mount Retention Type
- Solder Peg
- PCB Mount Retention
- With
- PCB Mounting Style
- Surface Mount
- Connector Mounting Type
- Board Mount
Configuration Features
- Module Orientation
- Right Angle
- Number of Positions
- 260
- Number of Rows
- 2
- Keying
- Standard
- Number of Keys
- 1
- Center Key
- Offset Left
Usage Conditions
- Operating Temperature Range
- -55 – 85 °C
- Operating Temperature Range
- -67 – 185 °F
Industry Standards
- UL Flammability Rating
- UL 94V-0
Contact Features
- Contact Base Material
- Copper Alloy
- PCB Contact Termination Area Plating Material
- Gold Flash
- Contact Underplating Material
- Nickel
- Contact Mating Area Plating Material
- Gold
- Contact Mating Area Plating Thickness
- .381 µm
- Contact Mating Area Plating Thickness
- 15 µin
- Contact Current Rating (Max)
- .5 A
- Socket Type
- Memory Card
- Socket Style
- SO DIMM
Operation/Application
- Circuit Application
- Power
Termination Features
- Insertion Style
- Cam-In
Body Features
- Ejector Type
- Locking
- Module Key Type
- Offset Left
- Retention Post Location
- Both Ends
- Latch Material
- High Temperature Thermoplastic
- Ejector Location
- Both Ends
- Retention Post Material
- Stainless Steel
Housing Features
- Centerline (Pitch)
- .5 mm
- Centerline (Pitch)
- .0197 in
- Housing Material
- High Temperature Thermoplastic
- Housing Color
- Black
Product Type Features
- DRAM Type
- Small Outline (SO)
- Connector System
- Cable-to-Board
- Profile
- High
- Row-to-Row Spacing
- 8.2 mm
- Sealable
- No
- Row-to-Row Spacing
- .322 in
- Connector & Contact Terminates To
- Printed Circuit Board
- Center Post
- Without
- Product Type
- Socket
Electrical Characteristics
- DRAM Voltage
- 1.2 V
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