- Contact Current Rating (Max)
- 10 A
- Contact Current Rating (Max)
- 12 A
- Contact Retention
- Without
- Contact Termination Area Plating Material
- Pre-Tin
- Contact Mating Area Plating Material
- Pre-Tin
- Contact Mating Area Plating Thickness
- 3.81 – 5.08 µm
- Contact Mating Area Plating Thickness
- 150 – 200 µin
- Contact Termination Area Plating Thickness
- 2.54 µm
- Multiple Contact Types
- Without
- Contact Termination Area Plating Thickness
- 100 µin
- Underplate Material Thickness
- 1.27 µm
- Contact Layout
- Matrix
- Underplate Material Thickness
- 50 µin