TE Connectivity
5353729-8
1 / 1
- Part Number
- 5353729-8
- Erhalten Sie bis zu 90 Tage Zahlungsziele von 500+ Lieferanten
- Wiederverkaufsrabatte bis zu 40%!
Preisanfrage senden
1
Zahlungsmöglichkeiten:
Packaging Features
- Packaging Method
- Soft Tray
- Packaging Quantity
- 18
Dimensions
- Stack Height
- 4 mm
- Stack Height
- 6 mm
- Stack Height
- 8 mm
- Stack Height
- 12 mm
- Height
- 4 mm
- PCB Thickness (Recommended)
- .2 in
- Stack Height
- .472 in
- Height
- .157 in
Mechanical Attachment
- PCB Mount Retention Type
- Solder Peg
- Mating Alignment
- With
- Mating Alignment Type
- Polarization
- PCB Mount Retention
- With
- PCB Mount Alignment
- With
- PCB Mount Alignment Type
- Locating Posts
Configuration Features
- Stackable
- Yes
- PCB Mount Orientation
- Vertical
- Number of Positions
- 200
- Board-to-Board Configuration
- Mezzanine
- Number of Rows
- 2
- Post Entry Direction
- With
Usage Conditions
- Operating Temperature Range
- -40 – 85 °C
- High Temperature Compatible
- Yes
- Operating Temperature Range
- -40 – 185 °F
Industry Standards
- UL Flammability Rating
- UL 94V-0
Contact Features
- Contact Base Material
- Copper Alloy
- PCB Contact Termination Area Plating Material
- Gold
- PCB Contact Termination Area Plating Material
- Tin
- Contact Mating Area Plating Material
- Gold
- Contact Mating Area Plating Thickness
- .2 µm
- Contact Type
- Socket
- Contact Mating Area Plating Thickness
- 7.874 µin
- Contact Current Rating (Max)
- .5 A
- Contact Layout
- Inline
- PCB Contact Termination Area Plating Thickness
- .05 µm
- PCB Contact Termination Area Plating Thickness
- 1 µm
- Contact Plating Thickness
- 0.05–0.127
- PCB Contact Termination Area Plating Thickness
- 1.9685 µin
- PCB Contact Termination Area Plating Thickness
- 39.37 µin
- Contact Plating Thickness
- 1
- Contact Plating Thickness
- 1.3
Operation/Application
- Assembly Process Feature
- Vacuum Cover
- Pick and Place Cover
- With
- For Use With
- Plug
Termination Features
- Termination Method to Printed Circuit Board
- Surface Mount
Body Features
- Busbar Mating Area Plating Thickness
- 200
Housing Features
- Centerline (Pitch)
- .6 mm
- Centerline (Pitch)
- .024 in
- Housing Material
- High Temperature Thermoplastic
Product Type Features
- Connector Assembly Type
- PCB Mount Receptacle
- Connector System
- Board-to-Board
- Connector & Contact Terminates To
- Printed Circuit Board
- Ground Component Type
- Grounding Contact
- Boss
- Yes
- Series
- Free Height
- Connector Type
- Connector Assembly
- Product Type
- Connector
Electrical Characteristics
- Dielectric Withstanding Voltage
- 200 VAC
- Insulation Resistance
- 2 MΩ
- Voltage
- 50 VAC
- Insulation Resistance
- 200 VAC
Ähnliche Produkte
Andere Kategorien
AktuatorenBlöckeKabel, Rohre & SchläucheKompressorenKontrolleKupplungen & FittingsZylinder & KolbenElektronikFilterHVACIndustrie-PCs & HMIsBeleuchtungLineartechnikMotorenStromversorgungLeistungsübertragungPumpen & VentileErneuerbare energieRobotikDichtungen, Ringe & VerbinderSensoren und MessgeräteWerkzeuge und ZubehörCNCSonstiges