TE Connectivity
767130-1
1 / 1
- Part Number
- 767130-1
- Erhalten Sie bis zu 90 Tage Zahlungsziele von 500+ Lieferanten
- Wiederverkaufsrabatte bis zu 40%!
Preisanfrage senden
1
Zahlungsmöglichkeiten:
Signal Characteristics
- Data Rate
- 10 Gb/s
- Differential Signaling
- Yes
Packaging Features
- Packaging Method
- Box & Tube
- Packaging Method
- Tube
- Packaging Quantity
- 21
Dimensions
- Stack Height
- 15.62 mm
- Stack Height
- 18 mm
- Stack Height
- 20 mm
- Stack Height
- 21.6 mm
- Stack Height
- 27 mm
- Stack Height
- 27.8 mm
- Stack Height
- 29 mm
- Stack Height
- 31.9 mm
- Length
- 25.4 mm
- Stack Height
- 1.255 in
- PCB Thickness (Recommended)
- .76 in
- Height
- 15.0114 mm
- Length
- 1 in
- Height
- .591 in
- Width
- 8 mm
- Width
- .315 in
Mechanical Attachment
- Mating Alignment
- With
- Mating Alignment Type
- Polarization
- PCB Mount Retention
- Without
- PCB Mount Alignment
- With
- Connector Mounting Type
- Board Mount
- PCB Mount Alignment Type
- Locating Posts
- Mating Retention
- Without
Configuration Features
- Stackable
- No
- Number of Columns
- 19
- PCB Mount Orientation
- Vertical
- Number of Positions
- 38
- Board-to-Board Configuration
- Mezzanine
- Number of Power Positions
- 1
- Number of Rows
- 2
- Number of Signal Positions
- 38
Usage Conditions
- Operating Temperature Range
- -55 – 125 °C
- Operating Temperature Range
- -67 – 257 °F
Industry Standards
- UL Flammability Rating
- UL 94V-0
- Agency/Standard
- CSA
- UL File Number
- E28476
- UL Rating
- Listed
- CSA File Number
- 1195944
- CSA Certified
- Yes
Contact Features
- Contact Base Material
- Copper Alloy
- PCB Contact Termination Area Plating Material
- Tin-Lead
- Contact Configuration
- Dual Beam
- Contact Mating Area Plating Material
- Gold or Palladium Nickel or Performance Based
- Contact Mating Area Plating Thickness
- .76 µm
- Contact Type
- Socket
- Contact Mating Area Plating Thickness
- 30 µin
- Contact Current Rating (Max)
- 11.5 A
- Tin to Lead Ratio
- 60 / 40
- Contact Layout
- Inline
- PCB Contact Termination Area Plating Thickness
- 150 – 250 µin
Operation/Application
- Pick and Place Cover
- Without
- Circuit Application
- Signal
Termination Features
- Termination Method to Printed Circuit Board
- Hybrid Surface Mount
Housing Features
- Centerline (Pitch)
- .64 mm
- Centerline (Pitch)
- .025 in
- Housing Material
- Liquid crystal polymer(LCP)
- Housing Entry Style
- Bottom
Product Type Features
- Connector Assembly Type
- PCB Mount Receptacle
- Connector System
- Board-to-Board
- Sealable
- No
- Connector & Contact Terminates To
- Printed Circuit Board
- Boss
- Yes
- Series
- MICTOR
- Connector Type
- Connector Assembly
- Product Type
- Connector
Electrical Characteristics
- Impedance
- 38 Ω
- Insulation Resistance
- 2 MΩ
- Voltage
- 1 VDC
- Voltage
- 30 VAC
- Insulation Resistance
- 38 VAC
Ähnliche Produkte
Andere Kategorien
AktuatorenBlöckeKabel, Rohre & SchläucheKompressorenKontrolleKupplungen & FittingsZylinder & KolbenElektronikFilterHVACIndustrie-PCs & HMIsBeleuchtungLineartechnikMotorenStromversorgungLeistungsübertragungPumpen & VentileErneuerbare energieRobotikDichtungen, Ringe & VerbinderSensoren und MessgeräteWerkzeuge und ZubehörCNCSonstiges