TE Connectivity
146894-2
1 / 1
- Part Number
- 146894-2
- Termin płatności do 90 dni od 500+ dostawców.
- Rabaty na odsprzedaż do 40%!
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Metody płatności:
Signal Characteristics
- Differential Signaling
- Yes
Packaging Features
- Packaging Method
- Tape & Reel
- Packaging Quantity
- 450
Dimensions
- Stack Height
- 11 mm
- Stack Height
- 12 mm
- PCB Thickness (Recommended)
- .76 in
- Length
- 44.22 mm
- Stack Height
- .472 in
- Length
- 1.74 in
- Height
- 7.37 mm
- Mating Post Length
- 2 mm
- Height
- .29 in
- Tail Length
- .081 in
- Width
- 3.81 mm
- Width
- 150 in
Mechanical Attachment
- PCB Mount Retention Type
- None
- Mating Alignment
- Without
- Mating Alignment Type
- None
- PCB Mount Retention
- Without
- PCB Mount Alignment
- With
- PCB Mount Alignment Type
- Locating Posts
- Mating Retention
- Without
Configuration Features
- Stackable
- Yes
- Number of Columns
- 42
- PCB Mount Orientation
- Vertical
- Number of Positions
- 84
- Board-to-Board Configuration
- Mezzanine
- Number of Rows
- 2
Usage Conditions
- Operating Temperature Range
- -55 – 110 °C
- Operating Temperature Range
- -67 – 230 °F
Industry Standards
- Industry Standard
- IEEE 1386
- UL Flammability Rating
- UL 94V-0
- Agency/Standard
- CSA
- Agency/Standard
- UL
- UL File Number
- E28476
- UL Rating
- Listed
- CSA File Number
- LR7189
- CSA Certified
- Yes
Contact Features
- Contact Base Material
- Phosphor Bronze
- PCB Contact Termination Area Plating Material
- Tin-Lead
- Contact Configuration
- Single Beam
- Contact Mating Area Plating Material
- Gold
- Contact Mating Area Plating Thickness
- .76 µm
- Contact Mating Area Plating Thickness
- 29.9212 µin
- Contact Current Rating (Max)
- 1 A
- Tin to Lead Ratio
- 93 / 7
- Underplate Material Thickness
- 1.27 µm
- Underplate Material Thickness
- 50 µin
- Contact Layout
- Inline
- PCB Contact Termination Area Plating Thickness
- 3.81 µm
- Contact Plating Thickness
- .127 – .254
- PCB Contact Termination Area Plating Thickness
- 150 µin
- Contact Plating Thickness
- 2
Operation/Application
- Assembly Process Feature
- Pick and Place Cover
- Pick and Place Cover
- With
Termination Features
- Termination Method to Printed Circuit Board
- Surface Mount
Housing Features
- Centerline (Pitch)
- 1 mm
- Housing Material
- Thermoplastic
- Centerline (Pitch)
- .039 in
- Housing Entry Style
- Top
Product Type Features
- Connector Assembly Type
- PCB Mount Receptacle
- Connector System
- Board-to-Board
- Row-to-Row Spacing
- 1 mm
- Connector & Contact Terminates To
- Printed Circuit Board
- Series
- 1mm FH
- Connector Type
- Connector Assembly
- Product Type
- Connector
Electrical Characteristics
- Insulation Resistance
- 2 MΩ
- Voltage
- 250 VAC
- Insulation Resistance
- 84 VAC
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