TE Connectivity
149013-1
1 / 1
- Part Number
- 149013-1
- Termin płatności do 90 dni od 500+ dostawców.
- Rabaty na odsprzedaż do 40%!
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Metody płatności:
Packaging Features
- Packaging Method
- Tube
- Packaging Quantity
- 19
Dimensions
- Stack Height
- 18.75 mm
- PCB Thickness (Recommended)
- .76 in
- Stack Height
- .738 in
- Height
- 16.46 mm
- Height
- .65 in
- Tail Length
- .145 in
Mechanical Attachment
- PCB Mount Retention Type
- Action/Compliant Tail
- Mating Alignment
- With
- Mating Alignment Type
- Polarization
- PCB Mount Retention
- With
- PCB Mount Alignment
- With
- Connector Mounting Type
- Board Mount
- PCB Mount Alignment Type
- Locating Posts
Configuration Features
- Stackable
- Yes
- PCB Mount Orientation
- Vertical
- Number of Positions
- 40
- Board-to-Board Configuration
- Vertical
- Number of Rows
- 2
Usage Conditions
- Operating Temperature Range
- -65 – 125 °C
- Flame Retardant
- Yes
- Operating Temperature Range
- -85 – 257 °F
Contact Features
- Contact Base Material
- Phosphor Bronze
- PCB Contact Termination Area Plating Material
- Tin-Lead
- Contact Mating Area Plating Material
- Gold
- Contact Mating Area Plating Thickness
- .76 µm
- Contact Mating Area Plating Thickness
- 30 µin
- Contact Type
- Pin
- Contact Current Rating (Max)
- 10.5 A
- PCB Contact Termination Area Plating Thickness
- .63 – 1.91 µm
- PCB Contact Termination Area Plating Thickness
- 24.8 – 75.19 µin
Operation/Application
- Pick and Place Cover
- Without
- Circuit Application
- Signal
Termination Features
- Termination Method to Printed Circuit Board
- Through Hole - Press-Fit
- Termination Post Length
- 3.69 mm
Body Features
- Busbar Mating Area Plating Thickness
- 30
- Cover Material
- Phosphor Bronze
- Busbar Termination Area Plating Material
- Tin-Lead with Nickel underplated
- Busbar Material
- Phosphor Bronze
- Busbar Mating Area Plating Material
- Gold
Housing Features
- Centerline (Pitch)
- 1.27 mm
- Centerline (Pitch)
- .05 in
- Housing Material
- High Temperature Thermoplastic
Product Type Features
- Connector Assembly Type
- PCB Mount Header
- Connector System
- Board-to-Board
- Row-to-Row Spacing
- 2.54 mm
- Row-to-Row Spacing
- .1 in
- Sealable
- No
- Connector & Contact Terminates To
- Printed Circuit Board
- Connector Type
- Connector Assembly
- Product Type
- Connector
Electrical Characteristics
- Insulation Resistance
- 40 VAC
- Voltage
- 30 VAC
- Insulation Resistance
- 2 MΩ
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