Upm Expanded Pin Assembly Sele
1645502-1
1645502-1
1645502-1
1645502-1
1645502-1
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Additional Information

Part Number
1645502-1

Packaging Features

Packaging Method
Box & Tube

Dimensions

PCB Thickness (Recommended)
1.27 in

Mechanical Attachment

Mating Alignment
With
Mating Alignment Type
Polarization
PCB Mount Retention
Without
PCB Mount Alignment
With
Connector Mounting Type
Board Mount
PCB Mount Alignment Type
Locating Posts

Configuration Features

Number of Positions
8
Board-to-Board Configuration
Right Angle

Usage Conditions

Operating Temperature Range
-55 – 125 °C
Operating Temperature Range
-67 – 257 °F

Contact Features

Contact Mating Area Plating Material
Gold or Palladium Nickel
Contact Mating Area Plating Thickness
1.27 µm
Contact Mating Area Plating Thickness
50 µin
Contact Current Rating (Max)
10 A
Contact Current Rating (Max)
16 A

Operation/Application

Pick and Place Cover
Without
Circuit Application
Signal

Housing Features

Centerline (Pitch)
3.04 mm
Centerline (Pitch)
.12 in

Product Type Features

Connector Assembly Type
PCB Mount Header
Connector System
Board-to-Board
Sealable
No
Connector & Contact Terminates To
Printed Circuit Board
Connector Type
Connector Assembly

Electrical Characteristics

Insulation Resistance
8 VAC

Dokumenty

Data Sheet

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