TE Connectivity
2-2057360-8
Sm,Hd,St,080,000,00,Pb,N,28
- Termin płatności do 90 dni od 500+ dostawców.
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Metody płatności:
Additional Information
- Part Number
- 2-2057360-8
Packaging Features
- Packaging Method
- Tray
- Packaging Quantity
- 24
Dimensions
- Stack Height
- 28 mm
- PCB Thickness (Recommended)
- .076 in
- Height
- 27.8 mm
- Stack Height
- 1.102 in
- Height
- 1.09254 in
- Tail Length
- .057 in
Mechanical Attachment
- PCB Mount Retention Type
- Compliant Pin
- Mating Alignment
- With
- Mating Alignment Type
- Polarization
- PCB Mount Retention
- With
- PCB Mount Alignment
- Without
- Connector Mounting Type
- Board Mount
Configuration Features
- Stackable
- Yes
- Number of Contacts
- 259
- Number of Pairs
- 80
- PCB Mount Orientation
- Vertical
- Number of Positions
- 259
- Board-to-Board Configuration
- Vertical
- Number of Power Positions
- 0
- Number of Single Ended Lines
- 0
- Number of Signal Positions
- 8
- Pairs per Column
- 8
Usage Conditions
- Operating Temperature Range
- -55 – 85 °C
- Operating Temperature Range
- -67 – 185 °F
Industry Standards
- UL Flammability Rating
- UL 94V-0
Contact Features
- Contact Base Material
- Copper Alloy
- PCB Contact Termination Area Plating Material
- Tin-Lead
- Contact Shape
- Round
- Contact Mating Area Plating Material
- Gold
- Contact Mating Area Plating Thickness
- .076 µm
- Contact Type
- Pin
- Contact Mating Area Plating Thickness
- 2.99212 µin
- Contact Current Rating (Max)
- 1.5 A
- Contact Layout
- Staggered
- PCB Contact Termination Area Plating Thickness
- .5 – 2.54 µm
- PCB Contact Termination Area Plating Thickness
- 19.685 – 100 µin
Operation/Application
- Assembly Process Feature
- None
- Pick and Place Cover
- Without
- Circuit Application
- Signal
- For Use With
- Receptacle Assembly
Termination Features
- Termination Method to Printed Circuit Board
- Through Hole - Press-Fit
Body Features
- Busbar Mating Area Plating Thickness
- 750
Housing Features
- Centerline (Pitch)
- 1.27 mm
- Centerline (Pitch)
- 3.04 mm
- Centerline (Pitch)
- 6.09 mm
- Housing Material
- Thermoplastic
- Centerline (Pitch)
- .05 in
- Centerline (Pitch)
- .24 in
- Centerline (Pitch)
- .12 in
Product Type Features
- Connector Assembly Type
- PCB Mount Header
- Connector System
- Board-to-Board
- Sealable
- No
- Connector & Contact Terminates To
- Printed Circuit Board
- Connector Type
- Connector Assembly
- Boss
- No
- Product Type
- Connector
Electrical Characteristics
- Impedance
- 100 Ω
- Dielectric Withstanding Voltage
- 750 VAC
- Insulation Resistance
- 259 VAC
- Voltage
- 0 VDC
- Voltage
- 250 VAC
- Insulation Resistance
- 1000 MΩ
Inne kategorie
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