TE Connectivity
2007704-1
Imp100S,R,Ra3P10C,Rg,39
- Termin płatności do 90 dni od 500+ dostawców.
- Rabaty na odsprzedaż do 40%!
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Metody płatności:
Łącznie 620 części w magazynie od 1 dostawcy
Stan produktu:
Additional Information
- Part Number
- 2007704-1
Signal Characteristics
- Data Rate
- 20 – 25 Gb/s
- Number of Differential Pairs per Column
- 3
- Differential Signaling
- Yes
Packaging Features
- Packaging Method
- Box & Tube
- Packaging Method
- Tube
Dimensions
- PCB Hole Diameter
- .39 mm
- PCB Hole Diameter
- .015 in
- Length
- 26.6 mm
- Tail Length
- 1.2 mm
- Length
- 1.047 in
- PCB Thickness (Recommended)
- 1 mm
- Tail Length
- .047 in
- Height
- 13.3 mm
- Height
- .524 in
- Width
- 24.2 mm
- Width
- .953 in
Mechanical Attachment
- PCB Mount Retention Type
- Action/Compliant Tail & Screw
- PCB Mount Retention
- With
- Guide Hardware
- With
- Mating Alignment
- With
- Mating Alignment Type
- Keyed
- Connector Mounting Type
- Board Mount
- PCB Mount Alignment Type
- Locating Posts
- Mating Retention
- Without
Configuration Features
- Stackable
- No
- Number of Pairs
- 30
- Number of Positions
- 90
- Number of Rows
- 9
- Number of Columns
- 10
- Board-to-Board Configuration
- Right Angle
- PCB Mount Orientation
- Right Angle
- Guide Location
- Right
- Number of Signal Positions
- 60
- Number of Ground Positions
- 30
Usage Conditions
- Operating Temperature Range
- -55 – 85 °C
- Operating Temperature Range
- -67 – 185 °F
Industry Standards
- UL Rating
- Recognized
- UL File Number
- E28476
- CSA Certified
- Yes
- UL Flammability Rating
- UL 94V-0
Contact Features
- Contact Base Material
- Copper Alloy
- Contact Underplating Material
- Nickel
- Contact Current Rating (Max)
- .75 A
- Contact Termination Area Plating Thickness
- 1.27 µm
- Contact Mating Area Plating Thickness
- .762 µm
- Contact Termination Area Plating Thickness
- 50 µin
- Contact Termination Area Plating Material
- Tin
- Contact Mating Area Plating Thickness
- 30 µin
- Contact Design
- Dual Beam
- Underplate Material Thickness
- 1.27 µm
- Underplate Material Thickness
- 50 µin
- Contact Mating Area Plating Material
- Gold
- Contact Layout
- Inline
- Contact Style
- Press-Fit
- Contact Transmits (Typical)
- Signal (Data)
- Contact Type
- Socket
Operation/Application
- Circuit Application
- Signal
- For Use With
- Header
Termination Features
- Termination Method to Printed Circuit Board
- Through Hole - Press-Fit
Housing Features
- Centerline (Pitch)
- 1.9 mm
- Centerline (Pitch)
- .075 in
- Housing Color
- Black
- Housing Material
- LCP - GF (Liquid Crystal Polymer)
Product Type Features
- Connector System
- Board-to-Board
- Row-to-Row Spacing
- 1.35 mm
- Connector Style
- Receptacle
- Row-to-Row Spacing
- .053 in
- Shrouded
- Unshrouded
- Sealable
- No
- Connector & Contact Terminates To
- Printed Circuit Board
- Connector Type
- Connector Assembly
- Product Type
- Connector
- Make First / Break Last
- No
Electrical Characteristics
- Impedance
- 100 Ω
- Operating Voltage
- 30 VDC
- Operating Voltage
- 30 VAC
Modele CAD
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