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Part Number
50871-4
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Other

Spring Material
Beryllium Copper

Packaging Features

Packaging Method
Bag
Packaging Method
Loose Piece
Packaging Quantity
2000

Dimensions

Socket Length
7.32 mm
Hole Size (Recommended)
2.56 mm
Socket Length
.288 in
Wire/Cable Size
.823 – 1.04 mm²
Hole Size (Recommended)
.101 in
Wire/Cable Size
18 – 17 AWG
Mating Pin Diameter Range
1.07 – 1.24 mm
PCB Thickness (Recommended)
.79 – 3.18 mm
Mating Pin Diameter Range
.042 – .049 in
PCB Thickness (Recommended)
.031 – .125 in

Usage Conditions

Operating Temperature Range
-65 – 125 °C
Operating Temperature Range
-85 – 257 °F

Contact Features

Contact Base Material
Beryllium Copper
Contact Current Rating (Max)
7.5 A
Contact Spring Plating Thickness
.762 µm
Contact Spring Plating Thickness
30 µin
Contact Transmits (Typical)
Signal (Data)/Power
Contact Mating Area Plating Thickness
30 µm
Contact Mating Area Plating Thickness
30 µin
Contact Type
Socket
Contact Spring Plating Material
Gold
Socket Type
Discrete

Operation/Application

Circuit Application
Power & Signal

Termination Features

Termination Method to Printed Circuit Board
Through Hole - Press-Fit
Termination Method to Wire & Cable
Solder
Insertion Method
Hand/Semi-Automatic

Body Features

Sealant
No
Sleeve Material
Copper
Sleeve Plating Material
Gold Flash over Nickel

Product Type Features

Sleeve Style
Closed Bottom
Connector System
Cable-to-Board
Sealable
No
Connector & Contact Terminates To
Printed Circuit Board
Product Type
Contact
Profile
Zero
Wire/Cable Type
Discrete Wire