TE Connectivity
5177983-1
0.8Fh,R05H.5,040,08/Sn,Tu
- Termin płatności do 90 dni od 500+ dostawców.
- Rabaty na odsprzedaż do 40%!
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Metody płatności:
Łącznie 7457 części w magazynie od 7 dostawców
Stan produktu:
Additional Information
- Part Number
- 5177983-1
Packaging Features
- Packaging Method
- Box & Tube
- Packaging Method
- Tube
- Packaging Quantity
- 22
- Packaging Reel Diameter
- .5 in
Dimensions
- Stack Height
- 5 mm
- Stack Height
- 6 mm
- Stack Height
- 7 mm
- Stack Height
- 8 mm
- Stack Height
- .315 in
- Stack Height
- .276 in
- Height
- 5 mm
- PCB Thickness (Recommended)
- .2 in
- Stack Height
- .236 in
- Stack Height
- .197 in
- Height
- .197 in
Mechanical Attachment
- Mating Alignment
- With
- Mating Alignment Type
- Polarized
- PCB Mount Retention
- Without
- PCB Mount Alignment
- With
- Locating Post Length
- .5 mm
- PCB Mount Alignment Type
- Positioning Bosses
- Locating Post Length
- .02 in
Configuration Features
- Stackable
- Yes
- PCB Mount Orientation
- Vertical
- Number of Positions
- 40
- Board-to-Board Configuration
- Mezzanine
- Number of Rows
- 2
Usage Conditions
- Operating Temperature Range
- -40 – 125 °C
- High Temperature Compatible
- Yes
- Operating Temperature Range
- -40 – 257 °F
Industry Standards
- UL Flammability Rating
- UL 94V-0
Contact Features
- Contact Base Material
- Copper Alloy
- PCB Contact Termination Area Plating Material
- Tin
- Solder Tail Contact Plating Material Finish
- Matte
- Contact Shape
- Square
- Contact Mating Area Plating Material
- Gold
- Contact Mating Area Plating Thickness
- .2 µm
- Contact Mating Area Plating Thickness
- 8 µin
- Contact Type
- Socket
- Contact Current Rating (Max)
- .5 A
- Contact Layout
- Inline
- PCB Contact Termination Area Plating Thickness
- 2 µm
- PCB Contact Termination Area Plating Thickness
- 78.74 µin
Operation/Application
- Assembly Process Feature
- None
- Pick and Place Cover
- Without
- For Use With
- Plug
Termination Features
- Termination Method to Printed Circuit Board
- Surface Mount
Body Features
- Sealant
- No
- Busbar Mating Area Plating Thickness
- 500
Housing Features
- Centerline (Pitch)
- .8 mm
- Housing Material
- Matte
- Centerline (Pitch)
- .031 in
- Housing Entry Style
- Top
Product Type Features
- Connector Assembly Type
- PCB Mount Receptacle
- Connector System
- Board-to-Board
- Row-to-Row Spacing
- 2.4 mm
- Row-to-Row Spacing
- .0945 in
- Sealable
- No
- Connector & Contact Terminates To
- Printed Circuit Board
- Connector Type
- Connector Assembly
- Product Type
- Connector
- Boss
- Yes
- Series
- Free Height
Electrical Characteristics
- Voltage
- 100 VAC
- Insulation Resistance
- 500 VAC
- Dielectric Withstanding Voltage
- 500 VAC
- Insulation Resistance
- 2 MΩ
