TE Connectivity
1-2213755-3
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Opis
The reflow capable universal MATE-N-LOK product line has a thermoplastic housing designed to withstand high temperatures associated with reflow soldering. This allows for easy transition to a full reflow assembly process. Headers are designed with polarization features and a low contact mating force, allowing for easy mating. The standard .250” centerline allows for mating with TE’s existing universal MATE-N-LOK wire-to-board connectors.- Part Number
- 1-2213755-3
- Termin płatności do 90 dni od 500+ dostawców.
- Rabaty na odsprzedaż do 40%!
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Metody płatności:
Packaging Features
- Packaging Method
- Tube
Configuration Features
- Number of Positions
- 12
- PCB Mount Orientation
- Vertical
- Number of Power Positions
- 12
- Number of Rows
- 4
- Row-to-Row Spacing
- 6.35 mm
- Row-to-Row Spacing
- .25 in
- Board-to-Board Configuration
- Vertical
Usage Conditions
- Operating Temperature Range
- -40 – 105 °C
- Operating Temperature Range
- -40 – 221 °F
Industry Standards
- Glow Wire Rating
- GWT 750°C (Without Flame)
- Glow Wire Material Rating
- Material with GWF1 850°C
Contact Features
- Contact Current Rating (Max)
- 12 A
- Contact Termination Area Plating Material
- Pre-Tin
- Contact Mating Area Plating Material
- Pre-Tin
- Contact Mating Area Plating Thickness
- 1.18 µm
Operation/Application
- Circuit Application
- Power
Termination Features
- Termination Method to Printed Circuit Board
- Through Hole - Solder
Housing Features
- Centerline (Pitch)
- 6.35 mm
- UL Flammability Rating
- UL 94V-0
- Centerline (Pitch)
- .25 in
- Housing Color
- Black
- Housing Material
- LCP GF30 (Liquid Crystal Polymer)
Product Type Features
- Product Type
- Vertical Rectangular Connector
- Housing Type
- Socket
- Connector System
- Wire-to-Board
- Connector & Contact Terminates To
- Printed Circuit Board
- Contact Type
- Pin
Electrical Characteristics
- Operating Voltage
- 600 VAC
Dokumenty
Data Sheet
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