TE Connectivity

1-2213755-3

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Opis

The reflow capable universal MATE-N-LOK product line has a thermoplastic housing designed to withstand high temperatures associated with reflow soldering. This allows for easy transition to a full reflow assembly process. Headers are designed with polarization features and a low contact mating force, allowing for easy mating. The standard .250” centerline allows for mating with TE’s existing universal MATE-N-LOK wire-to-board connectors.
Part Number
1-2213755-3
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Packaging Features

Packaging Method
Tube

Configuration Features

Number of Positions
12
PCB Mount Orientation
Vertical
Number of Power Positions
12
Number of Rows
4
Row-to-Row Spacing
6.35 mm
Row-to-Row Spacing
.25 in
Board-to-Board Configuration
Vertical

Usage Conditions

Operating Temperature Range
-40 – 105 °C
Operating Temperature Range
-40 – 221 °F

Industry Standards

Glow Wire Rating
GWT 750°C (Without Flame)
Glow Wire Material Rating
Material with GWF1 850°C

Contact Features

Contact Current Rating (Max)
12 A
Contact Termination Area Plating Material
Pre-Tin
Contact Mating Area Plating Material
Pre-Tin
Contact Mating Area Plating Thickness
1.18 µm

Operation/Application

Circuit Application
Power

Termination Features

Termination Method to Printed Circuit Board
Through Hole - Solder

Housing Features

Centerline (Pitch)
6.35 mm
UL Flammability Rating
UL 94V-0
Centerline (Pitch)
.25 in
Housing Color
Black
Housing Material
LCP GF30 (Liquid Crystal Polymer)

Product Type Features

Product Type
Vertical Rectangular Connector
Housing Type
Socket
Connector System
Wire-to-Board
Connector & Contact Terminates To
Printed Circuit Board
Contact Type
Pin

Electrical Characteristics

Operating Voltage
600 VAC

Dokumenty

Data Sheet

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