- Contact Base Material
- Copper Alloy
- Contact Underplating Material
- Nickel
- Contact Shape
- Square
- Contact Mating Area Plating Material
- Tin
- Contact Mating Area Plating Material Finish
- Tin
- Contact Mating Area Plating Thickness
- 3.81 µm
- Contact Mating Area Plating Thickness
- 150 µin
- Contact Type
- Pin
- Contact Current Rating (Max)
- 5 A
- PCB Contact Termination Area Plating Thickness
- 3.81 µm
- Contact Layout
- Inline
- PCB Contact Termination Area Plating Thickness
- 150 µin
- Contact Style
- Straight
- PCB Contact Termination Area Plating Material
- Tin
- Underplate Material Thickness
- 1.27 µm
- Underplate Material Thickness
- 50 µin