1 / 1
thumbnail
Part Number
531143-3
  • Erhalten Sie bis zu 90 Tage Zahlungsziele von 500+ Lieferanten
  • Wiederverkaufsrabatte bis zu 40%!
Sign-Up
Preisanfrage senden
1
Zahlungsmöglichkeiten:
Fordern Sie ein Angebot an und wir senden Ihnen Informationen zu Verfügbarkeit und Preis.

Packaging Features

Packaging Method
Package
Packaging Quantity
4

Dimensions

Shrouded End Dimension
.332 in

Mechanical Attachment

PCB Mount Retention
Without
Panel Mount Feature
Without
Mating Connector Lock
Without
PCB Mounting Style
Through Hole
Mating Alignment Type
Polarization
Mating Alignment
With

Configuration Features

Selectively Loaded
No
PCB Mount Orientation
Vertical
Number of Positions
30
Number of Rows
2
Keyed
Yes

Contact Features

Contact Base Material
Beryllium Copper
PCB Contact Termination Area Plating Material
Tin-Lead
Contact Underplating Material
Nickel
Contact Protection
Without
Contact Shape
Square
Contact Type
Socket
Contact Mating Area Plating Thickness
50 µin
Contact Mating Area Plating Material
Gold
Contact Layout
Staggered

Operation/Application

For Use With
Header

Termination Features

Termination Method to Printed Circuit Board
Through Hole
Termination End Plating Material
Tin-Lead
Termination End Plating Thickness
100 µin

Body Features

Color
Blue
Post Size
.25 x .51 mm
Post Size
.01 x .02 in
Post Styles
Posted

Housing Features

Centerline (Pitch)
1.9 mm
Centerline (Pitch)
.075 in
Housing Material
Diallyl Phthalate
Housing Color
Blue

Product Type Features

Connector Assembly Type
PCB Mount Receptacle
Sealable
No
Connector & Contact Terminates To
Printed Circuit Board
Row-to-Row Spacing
.075 in
Gasket
Without
Product Type
Connector
Stabilizers
Without
Connector Type
Connector Assembly
Board Standoff
Without
Strain Relief
Without