TE Connectivity

1-2110110-1

Imp100S,R,Ra5P12C,Lg,39
1-2110110-1
  • Consigue plazos de pago de hasta 90 días de 500+ proveedores.
  • Descuentos de reventa de hasta el 40%!
Registrate
Enviar solicitud de precio
1
Formas de pago:
Solicite un presupuesto y le enviaremos información sobre disponibilidad y precio.

Additional Information

Part Number
1-2110110-1

Signal Characteristics

Data Rate
25 Gb/s
Number of Differential Pairs per Column
5
Differential Signaling
Yes

Packaging Features

Packaging Method
Box & Tube

Dimensions

PCB Hole Diameter
.39 mm
PCB Hole Diameter
.015 in
PCB Thickness (Recommended)
1 mm
Length
30.4 mm
PCB Thickness (Recommended)
.039 in
Tail Length
1.2 mm
Length
1.197 in
Tail Length
.047 in
Height
21.5 mm
Width
32.3 mm
Height
.846 in
Width
1.272 in

Mechanical Attachment

PCB Mount Retention Type
Action/Compliant Tail & Screw
PCB Mount Retention
With
Guide Hardware
With
Mating Alignment
With
Mating Alignment Type
Keyed
Connector Mounting Type
Board Mount
PCB Mount Alignment Type
Locating Posts
Mating Retention
Without

Configuration Features

Stackable
No
Number of Pairs
60
Number of Positions
180
Number of Rows
15
Number of Columns
12
Board-to-Board Configuration
Right Angle
PCB Mount Orientation
Right Angle
Guide Location
Left
Number of Signal Positions
120
Number of Ground Positions
60

Usage Conditions

Operating Temperature Range
-55 – 85 °C
Operating Temperature Range
-67 – 185 °F

Industry Standards

UL Rating
Recognized
UL File Number
E28476
CSA Certified
Yes
UL Flammability Rating
UL 94V-0

Contact Features

Contact Base Material
Copper Alloy
Contact Underplating Material
Nickel
Contact Current Rating (Max)
.75 A
PCB Contact Termination Area Plating Material Finish
Matte
Contact Termination Area Plating Thickness
1.27 µm
Contact Mating Area Plating Thickness
.76 µm
Contact Termination Area Plating Thickness
50 µin
Contact Mating Area Plating Thickness
29.92 µin
Contact Termination Area Plating Material
Tin
Contact Design
Dual Beam
Underplate Material Thickness
1.27 µm
Contact Mating Area Plating Material
Gold
Underplate Material Thickness
50 µin
Contact Layout
Inline
Contact Style
Press-Fit
Contact Transmits (Typical)
Signal (Data)
Contact Type
Socket

Operation/Application

Circuit Application
Signal

Termination Features

Termination Method to Printed Circuit Board
Through Hole - Press-Fit

Housing Features

Centerline (Pitch)
1.9 mm
Centerline (Pitch)
.075 in
Housing Color
Black
Housing Material
LCP (Liquid Crystal Polymer)

Product Type Features

Connector System
Board-to-Board
Row-to-Row Spacing
1.35 mm
Connector Style
Receptacle
Row-to-Row Spacing
.053 in
Shrouded
Unshrouded
Sealable
No
Connector & Contact Terminates To
Printed Circuit Board
Connector Type
Connector Assembly
Product Type
Connector
Make First / Break Last
No

Electrical Characteristics

Operating Voltage
30 VDC
Operating Voltage
30 VAC