147723-8
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Additional Information

Part Number
147723-8

Other

Comment
TE recommends mating gold or duplex plated headers with duplex plated receptacle assemblies., To obtain the minimum mating post length, add 0.51 [.020] (not including the post lead in chamfer) to the maximum point-of-contact dimension.

Dimensions

Height
6.73 mm [ .265 in ]
PCB Thickness (Recommended)
1.4 – 2.4 mm [ .055 – .094 in ]

Mechanical Attachment

PCB Mount Retention
Without

Configuration Features

Number of Rows
1
Stackable
Yes
Number of Positions
9

Usage Conditions

Operating Temperature Range (°C)
-65 – 125
High Temperature Compatible
Yes

Industry Standards

Approved Standards
CSA LE7189, UL E28476
MIL-C-55032
No
UL Flammability Rating
UL 94V-0

Contact Features

Contact Current Rating (A)
2
Contact Base Material
Phosphor Bronze
Solder Tail Contact Plating Material Finish
Bright
Solder Tail Contact Plating Material
Tin-Lead over Nickel
Solder Tail Contact Plating Thickness (µin)
150 – 300
Contact Mating Area Plating Material
Gold
Contact Layout
Inline
Contact Type
Socket
Contact Configuration
Single Tine
Contact Mating Area Plating Thickness (µin)
30

Operation/Application

Pick and Place Cover
Without
Assembly Process Feature
Board Standoff
For Use With
Mates with Headers

Termination Features

Termination Post Length
.99 mm [ .0389 in ]
Termination Method to PC Board
Surface Mount

Housing Features

Centerline
2.54 mm [ .1 in ]
Housing Material
Polyester - GF
Housing Color
Black
Housing Entry Style
Bottom or Top, Closed Entry

Product Type Features

Sealed
No
Applied Pressure
Standard
Connector Style
Receptacle
Profile
Standard
PCB Mounting Orientation
Vertical
Boss
Without
Connector Type
Connector Assembly
Applies To
Printed Circuit Board
Product Type
Connector
Series
AMPMODU, MOD IV

Electrical Characteristics

Termination Resistance
12 mΩ
Insulation Resistance (MΩ)
5000