TE Connectivity
1658043-2
1 / 1
- Part Number
- 1658043-2
Métodos de pago:
- Mejor oferta de:
Proveedor de confianza de Automa.Net- Disponibilidad:
- 36 piezasEn stockActualizado en: 10-05-2024
- Entrega Estimada:
- Bajo pedido
- Condición:
- Nuevo Precintado de Fábrica
Nuevo Precintado de Fábrica - Un artículo completamente nuevo, sin usar, sin abrir, sin daños, en su embalaje original sellado por el fabricante.
Proceso de Pago Seguro
Políticas de Devolución y Reembolso
Políticas de Envío
Políticas de Garantía
Other
- Comment
- Use of stand offs recommended. Contact Product Engineering for recommendations.
Packaging Features
- Packaging Method
- Box & Tray
- Packaging Method
- Tray
- Packaging Quantity
- 56
Dimensions
- Stack Height
- 5 mm
- Stack Height
- 8 mm
- Stack Height
- 11 mm
- Stack Height
- 16 mm
- Stack Height
- 19 mm
- Stack Height
- 22 mm
- Stack Height
- 25 mm
- Stack Height
- 30 mm
- Height
- 3.05 mm
- PCB Thickness (Recommended)
- .12 in
- Stack Height
- 1.181 in
- Tail Length
- .12 mm
- Height
- .119865 in
Mechanical Attachment
- Mating Alignment
- With
- Mating Alignment Type
- Guide Post
- PCB Mount Retention
- Without
- PCB Mount Alignment
- With
- Connector Mounting Type
- Board Mount
- PCB Mount Alignment Type
- Locating Posts
Configuration Features
- Selectively Loaded
- Fully Loaded
- Stackable
- No
- PCB Mount Orientation
- Vertical
- Number of Positions
- 80
- Board-to-Board Configuration
- Vertical
- Number of Rows
- 2
Usage Conditions
- Operating Temperature Range
- -65 – 125 °C
- Operating Temperature Range
- -85 – 257 °F
Contact Features
- Contact Base Material
- Phosphor Bronze
- PCB Contact Termination Area Plating Material
- Gold
- Contact Configuration
- Single Beam
- Contact Mating Area Plating Material
- Select Gold Flash
- Contact Mating Area Plating Thickness
- .12 µm
- Contact Mating Area Plating Thickness
- 5 µin
- Contact Type
- Socket
- Contact Current Rating (Max)
- 1.25 A
- Contact Current Rating (Max)
- 9.5 A
- Ground Contact Material
- Phosphor Bronze
Operation/Application
- Assembly Process Feature
- None
- Pick and Place Cover
- Without
- Circuit Application
- Signal
- For Use With
- Header
Termination Features
- Termination Method to Printed Circuit Board
- Surface Mount
Body Features
- Busbar Mating Area Plating Thickness
- 675
Housing Features
- Centerline (Pitch)
- .8 mm
- Housing Material
- LCP (Liquid Crystal Polymer)
- Centerline (Pitch)
- .031 in
Product Type Features
- Connector Assembly Type
- PCB Mount Receptacle
- Connector System
- Board-to-Board
- Row-to-Row Spacing
- 3.47 mm
- Sealable
- No
- Row-to-Row Spacing
- .136371 in
- Connector & Contact Terminates To
- Printed Circuit Board
- Series
- MICTOR SB
- Connector Type
- Connector Assembly
- Boss
- Yes
- Product Type
- Connector
Electrical Characteristics
- Impedance
- 50 Ω
- Dielectric Withstanding Voltage
- 675 VAC
- Insulation Resistance
- 80 VAC
- Voltage
- 125 VAC
- Insulation Resistance
- 2 MΩ
Modelos CAD
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