TE Connectivity
1658465-2
1 / 1
- Part Number
- 1658465-2
- Consigue plazos de pago de hasta 90 días de 500+ proveedores.
- Descuentos de reventa de hasta el 40%!
Enviar solicitud de precio
1
Formas de pago:
Other
- Comment
- Use of stand offs recommended. Contact Product Engineering for recommendations.
Packaging Features
- Packaging Method
- Box & Tray
- Packaging Method
- Tray
- Packaging Quantity
- 48
Dimensions
- Stack Height
- 11 mm
- Stack Height
- .433 in
- Height
- 10.06 mm
- PCB Thickness (Recommended)
- .76 in
- Height
- .395358 in
Mechanical Attachment
- Mating Alignment
- With
- Mating Alignment Type
- Guide Post
- PCB Mount Retention
- Without
- PCB Mount Alignment
- With
- Connector Mounting Type
- Board Mount
- PCB Mount Alignment Type
- Locating Posts
Configuration Features
- Selectively Loaded
- Fully Loaded
- Stackable
- No
- PCB Mount Orientation
- Vertical
- Number of Positions
- 80
- Board-to-Board Configuration
- Vertical
- Number of Rows
- 2
Usage Conditions
- Operating Temperature Range
- -65 – 125 °C
- Operating Temperature Range
- -85 – 257 °F
Contact Features
- Contact Base Material
- Phosphor Bronze
- PCB Contact Termination Area Plating Material
- Gold
- Contact Configuration
- Single Beam
- Contact Shape
- Square
- Contact Mating Area Plating Material
- Select Gold
- Contact Mating Area Plating Thickness
- .76 µm
- Contact Type
- Pin
- Contact Mating Area Plating Thickness
- 29.9212 µin
- Contact Current Rating (Max)
- 1.25 A
- Contact Current Rating (Max)
- 9.5 A
- PCB Contact Termination Area Plating Thickness
- .76 µm
- Ground Contact Material
- Phosphor Bronze
- PCB Contact Termination Area Plating Thickness
- 29.9212 µin
Operation/Application
- Assembly Process Feature
- None
- Pick and Place Cover
- Without
- Circuit Application
- Signal
- For Use With
- Receptacle Assembly
Termination Features
- Termination Method to Printed Circuit Board
- Surface Mount
Body Features
- Busbar Mating Area Plating Thickness
- 675
Housing Features
- Centerline (Pitch)
- .8 mm
- Housing Material
- LCP (Liquid Crystal Polymer)
- Centerline (Pitch)
- .031 in
Product Type Features
- Connector Assembly Type
- PCB Mount Header
- Connector System
- Board-to-Board
- Row-to-Row Spacing
- 4.73 mm
- Row-to-Row Spacing
- .185889 in
- Sealable
- No
- Connector & Contact Terminates To
- Printed Circuit Board
- Series
- MICTOR SB
- Connector Type
- Connector Assembly
- Boss
- Yes
- Product Type
- Connector
Electrical Characteristics
- Impedance
- 50 Ω
- Dielectric Withstanding Voltage
- 675 VAC
- Insulation Resistance
- 80 VAC
- Voltage
- 125 VAC
- Insulation Resistance
- 2 MΩ
Productos relacionados
Otras categorías
ActuadoresBloquesCables, tuberías y manguerasCompresoresControlAcoplamientos y AccesoriosCilindros y PistonesElectrónicaFiltrosHVACPCs industriales y HMIsIluminaciónTécnica linealMotoresFuente de alimentaciónTransmisión de energíaBombas y VálvulasEnergías renovablesRobóticaSellos, anillos y conectoresSensores y dispositivos de mediciónHerramientas y AccesoriosCNCOtros