- Contact Base Material
- Phosphor Bronze
- PCB Contact Termination Area Plating Material
- Tin
- Contact Underplating Material
- Nickel
- Contact Shape
- Square
- Contact Current Rating (Max)
- 1 A
- Contact Mating Area Plating Thickness
- .762 µm
- Contact Mating Area Plating Thickness
- 30 µin
- Contact Mating Area Plating Material
- Gold Flash over Palladium Nickel
- Contact Termination Area Plating Thickness
- 2.54 µm
- Contact Termination Area Plating Material
- Tin
- Contact Termination Area Plating Thickness
- 100 µin
- Contact Type
- Pin
- Contact Transmits (Typical)
- Signal (Data)