TE Connectivity
2-767004-2
Mict,Recpt,038,Assy,.025,Rec
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Un total de 23.594 Parts In-Stock de 4 Distributors
Condiciones del producto:
Additional Information
- Part Number
- 2-767004-2
Signal Characteristics
- Data Rate
- 10 Gb/s
- Differential Signaling
- Yes
Packaging Features
- Packaging Method
- Box & Tube
- Packaging Method
- Tube
- Packaging Quantity
- 21
Dimensions
- Stack Height
- 6.6 mm
- Stack Height
- 9 mm
- Stack Height
- 10.92 mm
- Stack Height
- 12.57 mm
- Stack Height
- 17.96 mm
- Stack Height
- 18.75 mm
- Stack Height
- 20 mm
- Stack Height
- 22.86 mm
- Height
- 6.096 mm
- Stack Height
- .9 in
- PCB Thickness (Recommended)
- .76 in
- Width
- 6.9 mm
- Height
- .24 in
- Length
- 25.4 mm
- Width
- .272 in
- Length
- 1 in
Mechanical Attachment
- Mating Alignment
- With
- Mating Alignment Type
- Polarization
- PCB Mount Retention
- Without
- PCB Mount Alignment
- With
- Connector Mounting Type
- Board Mount
- PCB Mount Alignment Type
- Locating Posts
- Mating Retention
- Without
Configuration Features
- Stackable
- No
- Number of Columns
- 19
- PCB Mount Orientation
- Vertical
- Number of Positions
- 38
- Board-to-Board Configuration
- Mezzanine
- Number of Power Positions
- 1
- Number of Rows
- 2
- Number of Signal Positions
- 38
Usage Conditions
- Operating Temperature Range
- -55 – 125 °C
- Operating Temperature Range
- -67 – 257 °F
Industry Standards
- UL Flammability Rating
- UL 94V-0
- UL File Number
- E28476
- Agency/Standard
- CSA
- UL Rating
- Listed
- CSA File Number
- 1195944
- CSA Certified
- Yes
Contact Features
- Contact Base Material
- Copper Alloy
- PCB Contact Termination Area Plating Material
- Tin-Lead
- Contact Configuration
- Dual Beam
- Contact Mating Area Plating Material
- Gold or Palladium Nickel or Performance Based
- Contact Mating Area Plating Thickness
- .76 µm
- Contact Mating Area Plating Thickness
- 30 µin
- Contact Type
- Socket
- Contact Current Rating (Max)
- 11.5 A
- Tin to Lead Ratio
- 60 / 40
- Contact Layout
- Inline
- PCB Contact Termination Area Plating Thickness
- 150 – 250 µin
Operation/Application
- Assembly Process Feature
- None
- Pick and Place Cover
- Without
- Circuit Application
- Signal
- For Use With
- Mates with Headers
Termination Features
- Termination Method to Printed Circuit Board
- Hybrid Surface Mount
Housing Features
- Centerline (Pitch)
- .64 mm
- Housing Material
- LCP (Liquid Crystal Polymer)
- Centerline (Pitch)
- .025 in
Product Type Features
- Connector Assembly Type
- PCB Mount Receptacle
- Connector System
- Board-to-Board
- Sealable
- No
- Connector & Contact Terminates To
- Printed Circuit Board
- Connector Type
- Connector Assembly
- Product Type
- Connector
- Boss
- No
- Series
- MICTOR
Electrical Characteristics
- Impedance
- 38 Ω
- Voltage
- 30 VAC
- Insulation Resistance
- 38 VAC
- Insulation Resistance
- 2 MΩ
- Voltage
- 1 VDC
