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Part Number
2288172-5
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Other

EMI Containment Feature Type
EMI Springs
Included Lightpipe
No

Packaging Features

Packaging Method
Tray

Dimensions

PCB Thickness (Recommended)
1.5 mm
Tail Length
1.8 mm
PCB Thickness (Recommended)
.059 in
Tail Length
.07 in

Mechanical Attachment

PCB Mounting Style
Through Hole Press-Fit

Configuration Features

Port Matrix Configuration
2 x 12
Lightpipe Configuration
None
Lightpipe Style
Standard
Number of Ports
24
Number of Positions
480

Usage Conditions

Operating Temperature Range
-40 – 85 °C
Operating Temperature Range
-40 – 185 °F

Industry Standards

UL Flammability Rating
UL 94V-0

Contact Features

Contact Mating Area Plating Material
Gold or Gold Flash over Palladium Nickel
Tail Plating Material
Tin
Contact Mating Area Plating Thickness
.76 µm
Contact Mating Area Plating Thickness
29.92 µin

Operation/Application

For Use With Pluggable I/O Products
zSFP+ SMT Connector
Pluggable I/O Applications
zSFP+ Thermally Enhanced
Circuit Application
Signal
Heat Sink Compatible
No

Termination Features

Termination Method to Printed Circuit Board
Through Hole - Press-Fit

Housing Features

Cage Material
Nickel Silver Alloy
Centerline (Pitch)
.8 mm
Centerline (Pitch)
.0315 in

Product Type Features

Form Factor
zSFP+
Product Type
Cage Assembly with Integrated Connector
Cage Type
Stacked
Included Heat Sink
No
Integrated Lightpipes
No
Connector System
Cable-to-Board
Sealable
Yes
Connector & Contact Terminates To
Printed Circuit Board

Electrical Characteristics

Data Rate (Max)
32 Gb/s

Documentos

Data Sheet

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