TE Connectivity
536303-4
200,Plug,Vt,125,30Au,Gu
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Additional Information
- Part Number
- 536303-4
Other
- Comment
- Part intended to mate with Right Angle Rcpt. Guide Pins purchased separately.
Packaging Features
- Packaging Method
- Tube
- Packaging Quantity
- 3
Dimensions
- Stack Height
- 10.92 mm
- PCB Thickness (Recommended)
- .76 in
- Height
- 8.64 mm
- Stack Height
- .43 in
- Height
- .34 in
- Tail Length
- .125 in
Mechanical Attachment
- Mating Alignment
- With
- Mating Alignment Type
- Guides
- PCB Mount Retention
- Without
- PCB Mount Alignment
- With
- Connector Mounting Type
- Board Mount
- PCB Mount Alignment Type
- Locating Posts
Configuration Features
- Stackable
- Yes
- PCB Mount Orientation
- Vertical
- Number of Positions
- 200
- Board-to-Board Configuration
- Vertical
- Number of Rows
- 2
Usage Conditions
- Operating Temperature Range
- -65 – 125 °C
- Operating Temperature Range
- -85 – 257 °F
- Flame Retardant
- Yes
Contact Features
- Contact Base Material
- Phosphor Bronze
- PCB Contact Termination Area Plating Material
- Tin-Lead
- Contact Mating Area Plating Material
- Gold
- Contact Mating Area Plating Thickness
- .76 µm
- Contact Mating Area Plating Thickness
- 30 µin
- Contact Type
- Pin
- Contact Current Rating (Max)
- 10.5 A
- PCB Contact Termination Area Plating Thickness
- 25 – 75 µin
Operation/Application
- Pick and Place Cover
- Without
- Circuit Application
- Signal
- For Use With
- Receptacle Assembly
- Solder Process Feature
- Board Standoff
Termination Features
- Termination Method to Printed Circuit Board
- Through Hole - Solder
Body Features
- Busbar Mating Area Plating Thickness
- 30
- Busbar Termination Area Plating Material
- Tin-Lead with Nickel underplated
- Busbar Mating Area Plating Material
- Gold
- Busbar Material
- Phosphor Bronze
- Cover Material
- Phosphor Bronze
Housing Features
- Centerline (Pitch)
- 1.27 mm
- Housing Material
- High Temperature Thermoplastic
- Centerline (Pitch)
- .05 in
Product Type Features
- Connector Assembly Type
- PCB Mount Header
- Connector System
- Board-to-Board
- Row-to-Row Spacing
- 2.5 mm
- Row-to-Row Spacing
- .1 in
- Sealable
- No
- Connector & Contact Terminates To
- Printed Circuit Board
- Boss
- No
- Connector Type
- Connector Assembly
- Profile
- Low
- Product Type
- Connector
Electrical Characteristics
- Voltage
- 30 VAC
- Insulation Resistance
- 200 VAC
- Insulation Resistance
- 2 MΩ
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