TE Connectivity
767061-2
Mict,Recpt,076,Assy,093,Pdni
- Consigue plazos de pago de hasta 90 días de 500+ proveedores.
- Descuentos de reventa de hasta el 40%!
Enviar solicitud de precio
1
Formas de pago:
Additional Information
- Part Number
- 767061-2
Signal Characteristics
- Data Rate
- 10 Gb/s
- Differential Signaling
- Yes
Packaging Features
- Packaging Method
- Box & Tube
- Packaging Method
- Tube
- Packaging Quantity
- 14
Dimensions
- Stack Height
- 2.5 mm
- Stack Height
- 6.6 mm
- Stack Height
- 9 mm
- Stack Height
- 10.92 mm
- Stack Height
- 17.96 mm
- Stack Height
- 18.75 mm
- Stack Height
- 20 mm
- Stack Height
- 22.86 mm
- Stack Height
- .9 in
- Height
- 6.096 mm
- PCB Thickness (Recommended)
- .12 in
- Height
- .24 in
- Length
- 38.1 mm
- Length
- 1.499 in
- Width
- 6.9 mm
- Width
- .272 in
Mechanical Attachment
- Mating Alignment
- With
- Mating Alignment Type
- Polarization
- PCB Mount Retention
- Without
- PCB Mount Alignment
- With
- Connector Mounting Type
- Board Mount
- PCB Mount Alignment Type
- Locating Posts
- Mating Retention
- Without
Configuration Features
- Stackable
- No
- Number of Columns
- 38
- PCB Mount Orientation
- Vertical
- Number of Positions
- 76
- Board-to-Board Configuration
- Mezzanine
- Number of Rows
- 2
- Number of Power Positions
- 2
- Number of Signal Positions
- 76
Usage Conditions
- Operating Temperature Range
- -55 – 125 °C
- Operating Temperature Range
- -67 – 257 °F
Industry Standards
- UL Flammability Rating
- UL 94V-0
- CSA Certified
- Yes
- UL Rating
- Listed
- Agency/Standard
- CSA
- CSA File Number
- 1195944
- UL File Number
- E28476
Contact Features
- Contact Base Material
- Copper Alloy
- PCB Contact Termination Area Plating Material
- Tin-Lead
- Contact Configuration
- Dual Beam
- Contact Mating Area Plating Material
- Gold or Palladium Nickel or Performance Based
- Contact Mating Area Plating Thickness
- .12 µm
- Contact Mating Area Plating Thickness
- 5 µin
- Contact Current Rating (Max)
- 11.5 A
- Tin to Lead Ratio
- 60 / 40
- Contact Layout
- Inline
Operation/Application
- Pick and Place Cover
- Without
- Circuit Application
- Signal
Termination Features
- Termination Method to Printed Circuit Board
- Hybrid Surface Mount
Housing Features
- Centerline (Pitch)
- .64 mm
- Housing Material
- Liquid crystal polymer(LCP)
- Centerline (Pitch)
- .025 in
- Housing Entry Style
- Bottom
Product Type Features
- Connector Assembly Type
- PCB Mount Receptacle
- Connector System
- Board-to-Board
- Sealable
- No
- Connector & Contact Terminates To
- Printed Circuit Board
- Series
- MICTOR
- Connector Type
- Connector Assembly
- Boss
- No
- Product Type
- Connector
Electrical Characteristics
- Impedance
- 76 Ω
- Voltage
- 2 VDC
- Insulation Resistance
- 76 VAC
- Voltage
- 30 VAC
- Insulation Resistance
- 2 MΩ
Productos relacionados
Otras categorías
ActuadoresBloquesCables, tuberías y manguerasCompresoresControlAcoplamientos y AccesoriosCilindros y PistonesElectrónicaFiltrosHVACPCs industriales y HMIsIluminaciónTécnica linealMotoresFuente de alimentaciónTransmisión de energíaBombas y VálvulasEnergías renovablesRobóticaSellos, anillos y conectoresSensores y dispositivos de mediciónHerramientas y AccesoriosCNCOtros