MOLEX
2010214162
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- Part Number
- 2010214162
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Reference - Drawing Numbers
- Packaging Specification
- 2010210001-000
- Product Specification
- 2009890001-000
- Sales Drawing
- 2010210024-000
Solder Process Data
- Duration at Max. Process Temperature (seconds)
- 010
- Lead-freeProcess Capability
- WAVE
- Max. Cycles at Max. Process Temperature
- 001
- Process Temperature max. C
- 260
Electrical
- Current - Maximum per Contact
- 1.4A
- Voltage - Maximum
- 125V AC
Physical
- Breakaway
- No
- Circuits (Loaded)
- 12
- Circuits (maximum)
- 12
- Color - Resin
- Black
- Durability (mating cycles max)
- 500
- First Mate / Last Break
- No
- Glow-Wire Capable
- No
- Guide to Mating Part
- Yes
- Keying to Mating Part
- None
- Lock to Mating Part
- Yes
- Material - Metal
- Copper Alloy
- Material - Plating Mating
- Gold
- Material - Plating Termination
- Matte Tin
- Material - Resin
- Liquid Crystal Polymer
- Net Weight
- 0.493/g
- Number of Rows
- 2
- Orientation
- Right Angle
- PC Tail Length
- 2.40mm
- PCB Locator
- Yes
- PCB Retention
- Yes
- PCB Thickness - Recommended
- 2.40mm
- Packaging Type
- Tube
- Pitch - Mating Interface
- 1.27mm
- Pitch - Termination Interface
- 1.27mm
- Plating min - Mating
- 0.381µm
- Plating min - Termination
- 2.000µm
- Polarized to Mating Part
- Yes
- Polarized to PCB
- Yes
- Robotic Placement
- Vacuum Pick-Up Tape
- Shrouded
- Fully
- Temperature Range - Operating
- -55° to +105°C
- Termination Interface: Style
- Through Hole
Product Environmental Compliance
- EU ELV
- Compliant
- EU RoHS
- Compliant
- REACH SVHC
- Not Contained Per -D(2020)9139-DC (19 Jan 2021)
- Low-Halogen Status
- Low-Halogen
Documenti
Data Sheet
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