TE Connectivity
1-767114-2
Mict,Rec,190,Asy,.025,Tape Pkg
- Ottenete termini di pagamento fino a 90 giorni da 500+ fornitori.
- Sconti sulla rivendita fino al 40%!
Invia una richiesta di prezzo
1
Metodi di pagamento:
Additional Information
- Part Number
- 1-767114-2
Signal Characteristics
- Data Rate
- 10 Gb/s
- Differential Signaling
- Yes
Packaging Features
- Packaging Method
- Tape
- Packaging Quantity
- 252
Dimensions
- Stack Height
- 6.6 mm
- Stack Height
- 9 mm
- Stack Height
- 10.92 mm
- Stack Height
- 12.57 mm
- Stack Height
- 17.96 mm
- Stack Height
- 18.75 mm
- Stack Height
- 20 mm
- Stack Height
- 22.86 mm
- Stack Height
- .9 in
- PCB Thickness (Recommended)
- .76 in
- Height
- 6.096 mm
- Height
- .24 in
- Length
- 76.2 mm
- Width
- 6.9 mm
- Length
- 3 in
- Width
- .272 in
Mechanical Attachment
- PCB Mount Retention Type
- Boardlock
- Mating Alignment
- With
- Mating Alignment Type
- Polarization
- PCB Mount Retention
- With
- PCB Mount Alignment
- With
- Connector Mounting Type
- Board Mount
- PCB Mount Alignment Type
- Locating Posts
- Mating Retention
- Without
Configuration Features
- Stackable
- No
- Number of Columns
- 95
- PCB Mount Orientation
- Vertical
- Number of Positions
- 190
- Board-to-Board Configuration
- Mezzanine
- Number of Rows
- 2
- Number of Power Positions
- 5
- Number of Signal Positions
- 190
Usage Conditions
- Operating Temperature Range
- -55 – 125 °C
- Operating Temperature Range
- -67 – 257 °F
Industry Standards
- UL Flammability Rating
- UL 94V-0
- CSA Certified
- Yes
- UL Rating
- Listed
- Agency/Standard
- CSA
- CSA File Number
- 1195944
- UL File Number
- E28476
Contact Features
- Contact Base Material
- Copper Alloy
- PCB Contact Termination Area Plating Material
- Tin-Lead
- Contact Configuration
- Dual Beam
- Contact Mating Area Plating Material
- Gold or Palladium Nickel or Performance Based
- Contact Mating Area Plating Thickness
- .76 µm
- Contact Mating Area Plating Thickness
- 30 µin
- Contact Type
- Socket
- Contact Current Rating (Max)
- 11.5 A
- Tin to Lead Ratio
- 60 / 40
- Contact Layout
- Inline
- PCB Contact Termination Area Plating Thickness
- 150 – 250 µin
Operation/Application
- Pick and Place Cover
- Without
- Circuit Application
- Signal
Termination Features
- Termination Method to Printed Circuit Board
- Hybrid Surface Mount
Housing Features
- Centerline (Pitch)
- .64 mm
- Centerline (Pitch)
- 24.003 mm
- Housing Material
- Liquid crystal polymer(LCP)
- Centerline (Pitch)
- .945 in
- Housing Entry Style
- Bottom
Product Type Features
- Connector Assembly Type
- PCB Mount Receptacle
- Connector System
- Board-to-Board
- Sealable
- No
- Connector & Contact Terminates To
- Printed Circuit Board
- Series
- MICTOR
- Connector Type
- Connector Assembly
- Boss
- No
- Product Type
- Connector
Electrical Characteristics
- Impedance
- 190 Ω
- Voltage
- 5 VDC
- Insulation Resistance
- 190 VAC
- Voltage
- 30 VAC
- Insulation Resistance
- 2 MΩ
Prodotti correlati
Altre categorie
AttuatoriBlocchiCavi, tubi e manichetteCompressoriControlloGiunzioni e raccordiCilindri e PistoniElettronicaFiltriHVACPC industriali e HMIsIlluminazioneTecnica lineareMotoriAlimentatoreTrasmissione di potenzaPompe e ValvoleEnergia rinnovabileRoboticaGuarnizioni, Anelli e ConnettoriSensori e dispositivi di misuraStrumenti e AccessoriCNCAltro