Semi-Hard Tray Ddr3 204P 5.2H Std Au0.76
2013289-3
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Additional Information

Part Number
2013289-3

Signal Characteristics

SGRAM Voltage
1.5 V

Other

Comment
With floating peg.

Packaging Features

Packaging Method
Semi-Hard Tray Assembly
Packaging Quantity
120

Dimensions

Stack Height
5.2 mm
Stack Height
.205 in

Mechanical Attachment

PCB Mount Retention Type
Solder Peg
PCB Mount Retention
With
PCB Mounting Style
Surface Mount
Connector Mounting Type
Board Mount

Configuration Features

Module Orientation
Right Angle
Number of Positions
204
Number of Rows
2
Center Key
Offset Left
Keying
Standard
Number of Bays
2
Number of Keys
1

Usage Conditions

Operating Temperature Range
-55 – 85 °C
Operating Temperature Range
-67 – 185 °F

Industry Standards

UL Flammability Rating
UL 94V-0

Contact Features

Contact Base Material
Copper Alloy
PCB Contact Termination Area Plating Material
Gold
Contact Mating Area Plating Material
Gold
Contact Mating Area Plating Thickness
.76 µm
Contact Current Rating (Max)
.5 A
Contact Mating Area Plating Thickness
30 µin
Socket Type
Memory Card
Socket Style
SO DIMM

Operation/Application

Circuit Application
Power

Termination Features

Insertion Style
Cam-In

Body Features

Ejector Type
Locking
Latch Material
Stainless Steel
Module Key Type
SGRAM
Latch Plating Material
Tin
Ejector Location
Both Ends

Housing Features

Centerline (Pitch)
.6 mm
Centerline (Pitch)
.024 in
Housing Color
Black
Housing Material
High Temperature Thermoplastic

Product Type Features

DRAM Type
Double Data Rate (DDR) 3
Connector System
Cable-to-Board
Profile
Standard
Row-to-Row Spacing
8.2 mm
Row-to-Row Spacing
.322 in
Sealable
No
Connector & Contact Terminates To
Printed Circuit Board
Product Type
Socket

Electrical Characteristics

DRAM Voltage
1.5 V