- Contact Base Material
- Copper Alloy
- Contact Underplating Material
- Nickel
- Wire Contact Termination Area Plating Material
- Tin
- Contact Mating Area Plating Material
- Tin
- Contact Mating Area Plating Material Finish
- Matte
- Contact Mating Area Plating Thickness
- 2.03 – 5.08 µm
- Contact Mating Area Plating Thickness
- 80 – 200 µin
- Contact Type
- Socket
- Contact Current Rating (Max)
- 5 A
- PCB Contact Termination Area Plating Thickness
- 2.03 – 5.08 µm
- PCB Contact Termination Area Plating Thickness
- 80 – 200 µin
- Contact Layout
- Inline
- PCB Contact Termination Area Plating Material
- Tin
- Wire Contact Termination Area Plating Thickness
- 2.03 – 5.08 µm
- Underplate Material Thickness
- .762 µm
- Wire Contact Termination Area Plating Thickness
- 80 – 200 µin
- Underplate Material Thickness
- 30 µin
- PCB Contact Termination Area Plating Material Finish
- Matte
- Wire Contact Termination Area Plating Material Finish
- Matte