768250004

Reference - Drawing Numbers

Application Specification

AS-76823-100-001

Packaging Specification

PK-76825-0000-001

Product Specification

1054171000-PS-000, 1720631000-PS-000, PS-76823-100-001

Sales Drawing

SD-76825-0100-000

Symbol/Footprint Data

SYM-76825-0004

Test Summary

TS-76823-100-001, TS-76825-001-001

Solder Process Data

Duration at Max. Process Temperature (seconds)

030

Lead-freeProcess Capability

SMC&WAVE

Max. Cycles at Max. Process Temperature

001

Process Temperature max. C

260

Agency Certification

CSA

LR19980

UL

E29179

Electrical

Current - Maximum per Contact

23.5A

Voltage - Maximum

600V

Physical

Breakaway

No

Circuits (Loaded)

4

Circuits (maximum)

4

Color - Resin

Black

First Mate / Last Break

No

Flammability

94V-0

Glow-Wire Capable

Yes

Keying to Mating Part

Yes

Lock to Mating Part

Yes

Mated Height

16.78mm

Material - Metal

Copper

Material - Plating Mating

Tin

Material - Plating Termination

Tin

Material - Resin

High Temperature Thermoplastic

Net Weight

2.836/g

Number of Rows

2

Orientation

Right Angle

PCB Locator

Yes

PCB Retention

Yes

PCB Thickness - Recommended

1.57mm, 2.36mm

Packaging Type

Tray

Pitch - Mating Interface

5.70mm

Pitch - Termination Interface

5.70mm

Plating min - Mating

1.524µm

Plating min - Termination

1.270µm

Polarized to Mating Part

Yes

Polarized to PCB

Yes

Shrouded

Yes

Surface Mount Compatible (SMC)

Yes

Temperature Range - Operating

-40° to +105°C

Termination Interface: Style

Through Hole

Unmated Height

14.53mm

Product Environmental Compliance

EU ELV

Not Relevant

EU RoHS

Compliant

REACH SVHC

Not Contained Per -D(2020)9139-DC (19 Jan 2021)

Low-Halogen Status

Low-Halogen

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