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Part Number
1823271-5
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Other

Solder Process
Reflow

Packaging Features

Packaging Quantity
38

Dimensions

Height
14.2 mm [ .559 in ]
Length
17.4 mm [ .685 in ]
Width
12 mm [ .472 in ]

Mechanical Attachment

Mating Retention
With
Mounting Angle
Vertical / 180°
Mounting Feature
With
PCB Mounting Style
Through Hole
Mating Alignment
With
PCB Mount Retention
With

Configuration Features

Keying
E
Number of Positions
4
Snap-Lock
Without

Usage Conditions

Operating Temperature Range
-40 – 105 °C [ -40 – 221 °F ]

Contact Features

Center Contact Plating Material
Gold (Au)
Contact Transmits (Typical)
Signal
Contact Type
Pin
Contact Mating Area Plating Material
Gold (Au)
Outer Contact Plating Material
Tin (Sn)
Mating Pin Diameter
.6 mm [ .024 in ]
Center Contact
With

Termination Features

Termination Method
Solder

Body Features

Ferrule
Without
Environmental Protection
Other

Housing Features

Housing Color
Green
Pitch
2 mm [ .079 in ]

Product Type Features

Hybrid Connector
No
Connector System
Wire-to-Board/Device
Shielded
Yes
Connector Type
Header
Board Standoff
Without
Sealed
No