1 / 1
thumbnail
Part Number
5050865-6
  • Ottenete termini di pagamento fino a 90 giorni da 500+ fornitori.
  • Sconti sulla rivendita fino al 40%!
Registrati
Invia una richiesta di prezzo
1
Metodi di pagamento:
Richiedete un preventivo e vi invieremo informazioni su disponibilità e prezzi.

Other

Spring Material
Beryllium Copper

Packaging Features

Packaging Method
Bag
Packaging Method
Loose Piece
Packaging Quantity
2000

Dimensions

Socket Length
6.6 mm
Socket Length
.26 in
Hole Size (Recommended)
1.83 mm
Wire/Cable Size
.518 – .823 mm²
Hole Size (Recommended)
.072 in
Wire/Cable Size
20 – 18 AWG
Mating Pin Diameter Range
.86 – 1.04 mm
PCB Thickness (Recommended)
.79 – 3.18 mm
Mating Pin Diameter Range
.034 – .041 in
PCB Thickness (Recommended)
.031 – .125 in

Usage Conditions

Operating Temperature Range
-65 – 125 °C
Operating Temperature Range
-85 – 257 °F

Contact Features

Contact Base Material
Beryllium Copper
Contact Current Rating (Max)
7.5 A
Contact Spring Plating Thickness
2.54 µm
Contact Type
Socket
Contact Spring Plating Thickness
30 µin
Contact Spring Plating Material
Tin
Socket Type
Discrete
Contact Transmits (Typical)
Signal (Data)/Power
Contact Mating Area Plating Thickness
2.54 µm

Operation/Application

Circuit Application
Power & Signal

Termination Features

Termination Method to Printed Circuit Board
Through Hole - Press-Fit
Termination Method to Wire & Cable
Solder
Insertion Method
Hand/Semi-Automatic

Body Features

Sealant
No
Sleeve Material
Copper
Sleeve Plating Material
Tin

Product Type Features

Sleeve Style
Open Bottom
Connector System
Cable-to-Board
Sealable
No
Connector & Contact Terminates To
Printed Circuit Board
Product Type
Contact
Profile
Zero
Wire/Cable Type
Discrete Wire