Weidmuller 1870540000

The LSF-SMT 3.50/18/180 3.5SN BK TU is engineered for printed circuit board applications, incorporating a 3.50 mm pitch and facilitating a 180° conductor outlet direction. The solder pin length measures 3.5 mm, accommodating a maximum clamping range of 1.5 mm². The terminals utilize a PUSH IN connection method and are suitable for through-hole (THT) soldering.

With a rated voltage of 300 V according to UL 1059 standards and a rated current of 12 A for group B, these terminals are certified for safety and reliability by cURus, CSA, and VDE. The design allows for wire cross-sections ranging from AWG 28 to AWG 14, ensuring compatibility with various conductor types.

The insulating material is LCP GF, providing enhanced durability and performance across a temperature range from -50 °C to 120 °C. Additionally, the component meets the IPC-A-610 Class 2 standard for quality assurance. The terminal's compact dimensions of 63.7 mm width, 17.5 mm height, and 7.8 mm depth facilitate efficient space utilization on PCBs.