AMP

2-1437514-0

322-Hcs5P2-100=Holtite Cnt
2-1437514-0
2-1437514-0
2-1437514-0
2-1437514-0
2-1437514-0
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Product Type Features

Sleeve Style
Open Bottom
Connector System
Cable-to-Board
Sealable
No
Connector & Contact Terminates To
Printed Circuit Board
Product Type
Contact
Profile
Zero
Wire/Cable Type
Discrete Wire

Body Features

Sealant
No
Sleeve Material
Copper
Sleeve Plating Material
Tin

Contact Features

Contact Base Material
Beryllium Copper
Contact Current Rating (Max)
5 A
Contact Type
Socket
Contact Spring Plating Material
Tin
Socket Type
Discrete
Contact Transmits (Typical)
Signal (Data)/Power
Contact Mating Area Plating Material
Gold

Termination Features

Termination Method to Printed Circuit Board
Through Hole - Press-Fit
Termination Method to Wire & Cable
Solder
Insertion Method
Hand/Semi-Automatic/Automatic

Dimensions

Socket Length
2.54 mm
Hole Size (Recommended)
1.04 mm
Socket Length
.1 in
Hole Size (Recommended)
.041 in
Mating Pin Diameter Range
.28 – .46 mm
Mating Pin Diameter Range
.406 – .533 mm
Mating Pin Diameter Range
.016 – .021 in
PCB Thickness (Recommended)
.79 – 3.18 mm
Mating Pin Diameter Range
.011 – .018 in
PCB Thickness (Recommended)
.03 – .05 in

Usage Conditions

Operating Temperature Range
-55 – 125 °C
Operating Temperature Range
-67 – 257 °F

Operation/Application

Circuit Application
Signal

Packaging Features

Packaging Method
Reel
Packaging Quantity
2500

Other

Spring Material
Beryllium Copper