AMP
5-1437514-9
8134-Hc-12P2=Holtite Contact 3
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Product Type Features
- Sleeve Style
- Open Bottom
- Connector System
- Cable-to-Board
- Sealable
- No
- Connector & Contact Terminates To
- Printed Circuit Board
- Wire/Cable Type
- Discrete Wire
- Product Type
- Contact
- Profile
- Zero
Body Features
- Sealant
- No
- Sleeve Material
- Copper
- Sleeve Plating Material
- Tin
Contact Features
- Contact Base Material
- Beryllium Copper
- Contact Current Rating (Max)
- 5 A
- Contact Transmits (Typical)
- Signal (Data)/Power
- Contact Type
- Socket
- Contact Spring Plating Material
- Tin
- Contact Mating Area Plating Thickness
- .76 µm
- Contact Mating Area Plating Material
- Gold
- Socket Type
- Discrete
Termination Features
- Termination Method to Printed Circuit Board
- Through Hole - Press-Fit
- Termination Method to Wire & Cable
- Solder
- Insertion Method
- Hand/Semi-Automatic
Dimensions
- Socket Length
- 3.96 mm
- Socket Length
- .156 in
- Hole Size (Recommended)
- 2.08 mm
- Hole Size (Recommended)
- .082 in
- Wire/Cable Size
- .081 – .162 mm²
- Mating Pin Diameter Range
- .89 – 1.14 mm
- Wire/Cable Size
- 28 – 25 AWG
- PCB Thickness (Recommended)
- .79 – 3.18 mm
- Mating Pin Diameter Range
- .035 – .045 in
- PCB Thickness (Recommended)
- .03 – .05 in
Usage Conditions
- Operating Temperature Range
- -65 – 125 °C
- Operating Temperature Range
- -85 – 257 °F
Operation/Application
- Circuit Application
- Signal
Packaging Features
- Packaging Method
- Loose Piece
- Packaging Quantity
- 2000
Other
- Spring Material
- Beryllium Copper
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