Elcon
1892713-1
Assy 2X5 Minipak Hde Seq1
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Product Type Features
- Connector Assembly Type
- PCB Mount Header
- Connector System
- Board-to-Board
- Sealable
- No
- Connector & Contact Terminates To
- Printed Circuit Board
- Connector Type
- Connector Assembly
Configuration Features
- Number of Positions
- 10
- Board-to-Board Configuration
- Right Angle
Electrical Characteristics
- Insulation Resistance
- 10 VAC
Contact Features
- Contact Mating Area Plating Material
- Gold
- Contact Mating Area Plating Thickness
- 1.27 µm
- Contact Current Rating (Max)
- 18 A
- Contact Mating Area Plating Thickness
- 50 µin
- Contact Mating Area Plating Material Finish
- Matte
Mechanical Attachment
- Mating Alignment
- With
- Mating Alignment Type
- Polarization
- PCB Mount Retention
- Without
- PCB Mount Alignment
- Without
- Connector Mounting Type
- Board Mount
Housing Features
- Centerline (Pitch)
- 1.98 mm
- Centerline (Pitch)
- .078 in
Dimensions
- Tail Length
- 1.27 mm
- PCB Thickness (Recommended)
- 1.27 in
Usage Conditions
- Operating Temperature Range
- -40 – 105 °C
- Operating Temperature Range
- -40 – 221 °F
Operation/Application
- Pick and Place Cover
- Without
- Circuit Application
- Power
Packaging Features
- Packaging Method
- Box & Tube
- Packaging Method
- Tube
Documents
Data Sheet
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