MOLEX

1510462150

EdgeLine 25 ESP Vertical Connector, 25 Gbps, 0.80mm Pitch, 2.36mm PCB Thickness, 40.0A Power Module, 150 Circuits, 2 Power Circuits
1510462150
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Reference - Drawing Numbers

Application Specification
AS-151046-0002-001
Electrical Model Document
EE-151046-0001
Product Specification
PS-151046-0001-001
S-Parameter Model
SP-151046-0001, SP-151046-0003, SP-151046-0004
Sales Drawing
SD-151046-2150
Symbol/Footprint Data
SYM-151046-2150
Test Summary
TS-151046-0001-001

Solder Process Data

Duration at Max. Process Temperature (seconds)
040
Lead-freeProcess Capability
REFLOW
Max. Cycles at Max. Process Temperature
001
Process Temperature max. C
265

Agency Certification

CSA
LR19980
UL
E29179

Electrical

Current - Maximum per Contact
1.5A, 40.0A
Voltage - Maximum
250V AC (RMS)/DC

Physical

(p)ower-(s)ignal Configuration
150s - 2p
Circuit Size Range
65-200 Circuits
Circuits (Loaded)
150
Circuits (maximum)
150
Color - Resin
Black
Durability (mating cycles max)
25
Flammability
94V-0
Material - Metal
Copper Alloy
Material - Plating Mating
Gold
Material - Plating Termination
Tin
Material - Resin
High Temperature Thermoplastic
Net Weight
10.344/g
PCB Locator
No
PCB Retention
Yes
PCB Thickness - Recommended
1.95mm
Packaging Type
Tray
Pitch - Mating Interface
0.80mm, 2.50mm
Pitch - Termination Interface
0.80mm
Plating min - Mating
0.762µm
Plating min - Termination
2.540µm
Polarized to Mating Part
Yes
Temperature Range - Operating
-40° to +105°C
Termination Interface: Style
Through Hole and Surface Mount

Product Environmental Compliance

EU ELV
Not Relevant
EU RoHS
Compliant
REACH SVHC
Not Contained Per -D(2020)9139-DC (19 Jan 2021)
Low-Halogen Status
Low-Halogen

Documents

Data Sheet

Download

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