MOLEX

2011731208

Slim-Grid Header, 8 Circuits, Surface Mount, Right-Angle, Shrouded, 0.76µm Gold (Au) Plated, with Pick-and-Place Polyimide Tape, Tube, Lead-Free
2011731208
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Reference - Drawing Numbers

Packaging Specification
2011730001-000
Product Specification
2009890001-000
Sales Drawing
2011730024-000

Solder Process Data

Duration at Max. Process Temperature (seconds)
010
Lead-freeProcess Capability
REFLOW
Max. Cycles at Max. Process Temperature
001
Process Temperature max. C
260

Agency Certification

CSA
LR19980
UL
E29179

Electrical

Current - Maximum per Contact
1.4A
Voltage - Maximum
125V AC

Physical

Breakaway
No
Circuits (Loaded)
8
Circuits (maximum)
8
Color - Resin
Black
Durability (mating cycles max)
500
First Mate / Last Break
No
Flammability
94V-0
Glow-Wire Capable
No
Guide to Mating Part
Yes
Keying to Mating Part
None
Lock to Mating Part
Yes
Material - Metal
Copper Alloy
Material - Plating Mating
Gold
Material - Plating Termination
Matte Tin
Material - Resin
Liquid Crystal Polymer
Net Weight
0.361/g
Number of Rows
2
Orientation
Right Angle
PCB Locator
No
PCB Retention
None
Packaging Type
Tube
Pitch - Mating Interface
1.27mm
Pitch - Termination Interface
1.27mm
Plating min - Mating
0.762µm
Plating min - Termination
2.000µm
Polarized to Mating Part
Yes
Polarized to PCB
No
Robotic Placement
Vacuum Pick-Up Tape
Shrouded
Fully
Temperature Range - Operating
-55° to +105°C
Termination Interface: Style
Surface Mount

Product Environmental Compliance

EU ELV
Not Relevant
EU RoHS
Compliant
REACH SVHC
Not Contained Per -D(2020)9139-DC (19 Jan 2021)
Low-Halogen Status
Low-Halogen

Documents

Data Sheet

Download

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