2040586102

QSFP-DD Assembly, Stacked 2x1, 4.50mm Tapered Fin Heat Sink

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Reference - Drawing Numbers

Application Tooling Documents: 2001991709-000
Sales Drawing: 2040586103-ASY
Test Summary: 2040580002-000

Agency Certification

CSA: LR19980
UL: E29179

Electrical

Current - Maximum per Contact: 0.5A
Grounding to Panel: Yes
Shielded: Yes

Physical

Circuits (Loaded): 152
Circuits (maximum): 152
Color - Resin: Black
Durability (mating cycles max): 100
Flammability: 94V-0
Gender: Female
Keying to Mating Part: None
Lock to Mating Part: Yes
Material - Metal: Copper Alloy
Material - Plating Mating: Gold
Material - Plating Termination: Tin
Material - Resin: High Temperature Thermoplastic
Net Weight: 51.740/g
Number of Rows: 2
Orientation: Right Angle
PC Tail Length: 1.70mm
PCB Locator: Yes
PCB Retention: Yes
PCB Thickness - Recommended: 1.53mm min.
Packaging Type: Tray
Pitch - Mating Interface: 0.80mm
Plating min - Mating: 0.760µm
Plating min - Termination: 0.760µm
Polarized to Mating Part: Yes
Polarized to PCB: Yes
Ports: 2
Surface Mount Compatible (SMC): No
Temperature Range - Operating: -40° to +85°C
Termination Interface: Style: Through Hole - Compliant Pin

Product Environmental Compliance

EU ELV: Not Relevant
EU RoHS: Compliant
REACH SVHC: Not Contained Per -D(2020)9139-DC (19 Jan 2021)
Low-Halogen Status: Low-Halogen

Documents

Data Sheet

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