MOLEX

440671002

Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm Thick PCB, 10 Circuits, 0.38µm Gold (Au) Selective Plating
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Reference - Drawing Numbers

Packaging Specification
PK-70873-0314-001
Product Specification
430450001-PS-KO-000, 430450001-PS-SP-000, PS-43045-001
Sales Drawing
SD-44067-001
Symbol/Footprint Data
SYM-44067-100X
Test Summary
430450005-TS-000, TS-43045-001-001, TS-43045-002-001, TS-46235-001-001

Solder Process Data

Duration at Max. Process Temperature (seconds)
030
Lead-freeProcess Capability
SMC&WAVE
Max. Cycles at Max. Process Temperature
003
Process Temperature max. C
260

Electrical

Current - Maximum per Contact
8.5A
Voltage - Maximum
250V

Physical

Breakaway
No
Circuits (Loaded)
10
Circuits (maximum)
10
Color - Resin
Black
Durability (mating cycles max)
30
First Mate / Last Break
No
Glow-Wire Capable
No
Guide to Mating Part
No
Keying to Mating Part
None
Lock to Mating Part
Yes
Material - Plating Mating
Gold
Material - Plating Termination
Tin
Material - Resin
High Temperature Thermoplastic
Net Weight
1.478/g
Number of Rows
2
Orientation
Vertical
PC Tail Length
4.01mm
PCB Locator
Yes
PCB Retention
Yes
PCB Thickness - Recommended
3.60mm
Packaging Type
Tray
Pitch - Mating Interface
3.00mm
Pitch - Termination Interface
3.00mm
Plating min - Mating
0.381µm
Plating min - Termination
2.540µm
Polarized to PCB
Yes
Shrouded
Fully
Stackable
No
Surface Mount Compatible (SMC)
Yes
Temperature Range - Operating
-40° to +105°C
Termination Interface: Style
Through Hole - Kinked Pin

Product Environmental Compliance

EU ELV
Not Relevant
EU RoHS
Compliant
REACH SVHC
Not Contained Per -D(2020)9139-DC (19 Jan 2021)
Low-Halogen Status
Low-Halogen

Documents

Data Sheet

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