788601502
DDR4 DIMM Socket, Ultra-Low-Profile, Vertical Through-Hole, 0.381µm Gold Plating, 288 Circuits, PCB Thickness 2.36mm, 3.18mm Tail Length, Black Housing, Black Latch
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Reference - Drawing Numbers
- Electrical Model Document
- EE-78860-002
- Packaging Specification
- PK-78860-001
- Product Specification
- PS-78860-001
- S-Parameter Model
- SP-78860-002
- Sales Drawing
- SD-78860-001
Solder Process Data
- Duration at Max. Process Temperature (seconds)
- 005
- Lead-freeProcess Capability
- SMC&WAVE
- Max. Cycles at Max. Process Temperature
- 002
- Process Temperature max. C
- 260
Agency Certification
- CSA
- LR19980
- UL
- E29179
Electrical
- Current - Maximum per Contact
- 0.75A
- Voltage - Maximum
- 29V AC (RMS)/DC
Physical
- Circuits (Loaded)
- 288
- Circuits (maximum)
- 288
- Durability (mating cycles max)
- 25
- Entry Angle
- Vertical (Top Entry)
- Flammability
- 94V-0
- Housing Color
- Black
- Keying to Mating Part
- Yes
- Latch Color
- Black
- Material - Metal
- Copper Alloy
- Material - Plating Mating
- Gold over Nickel
- Material - Plating Termination
- Matte Tin
- Material - Resin
- Nylon
- Net Weight
- 5.314/g
- PC Tail Length
- 3.18mm
- PCB Locator
- Yes
- PCB Retention
- Yes
- PCB Thickness - Recommended
- 2.36mm
- Packaging Type
- Tray
- Pitch - Mating Interface
- 0.85mm
- Pitch - Termination Interface
- 0.85mm
- Plating min - Mating
- 0.381µm
- Plating min - Termination
- 2.540µm
- Temperature Range - Operating
- -55° to +85°C
- Termination Interface: Style
- Through Hole
General
- Status
- Active
- Category
- Memory Module Sockets
- Series
- 78860
- Component Type
- Socket
- Electrical Model
- Yes
- JEDEC Outline
- MO-309
- Overview
- DDR4 DIMM Sockets
- Product Name
- DDR4 DIMM
- UPC
- 887191450452
Product Environmental Compliance
- EU ELV
- Not Relevant
- EU RoHS
- Compliant
- REACH SVHC
- Not Contained Per -ED/88/2018 (15 January 2019)
- Low-Halogen Status
- Low-Halogen