877591874
Milli-Grid Header, Surface Mount, Vertical, 18 Circuits, 0.38µm Gold (Au) Selective Plating, with Pick-and-Place Cap, Tape and Reel Packaging, without Press-fit Plastic Pegs, Lead-Free
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Reference - Drawing Numbers
- Application Specification
- 503940001-AS-000
- Packaging Specification
- PK-89990-485-001
- Product Specification
- PS-87761-100-001
- Sales Drawing
- SD-87759-117-001
Solder Process Data
- Duration at Max. Process Temperature (seconds)
- 010
- Lead-freeProcess Capability
- REFLOW
- Max. Cycles at Max. Process Temperature
- 003
- Process Temperature max. C
- 260
Agency Certification
- UL
- E29179
Electrical
- Current - Maximum per Contact
- 2.0A
- Voltage - Maximum
- 125V
Physical
- Breakaway
- Yes
- Circuits (Loaded)
- 18
- Circuits (maximum)
- 18
- Color - Resin
- Black
- Durability (mating cycles max)
- 100
- First Mate / Last Break
- No
- Flammability
- 94V-0
- Glow-Wire Capable
- No
- Guide to Mating Part
- No
- Keying to Mating Part
- None
- Lock to Mating Part
- None
- Mated Height
- 3.80mm
- Material - Metal
- Phosphor Bronze
- Material - Plating Mating
- Gold
- Material - Plating Termination
- Tin
- Material - Resin
- Nylon
- Net Weight
- 0.454/g
- Number of Rows
- 2
- Orientation
- Vertical
- PCB Locator
- No
- PCB Retention
- None
- Packaging Type
- Embossed Tape on Reel
- Pitch - Mating Interface
- 2.00mm
- Pitch - Termination Interface
- 2.00mm
- Plating min - Mating
- 0.381µm
- Polarized to Mating Part
- No
- Polarized to PCB
- No
- Robotic Placement
- Pick and Place Cap
- Shrouded
- No
- Stackable
- No
- Temperature Range - Operating
- -55° to +105°C
- Termination Interface: Style
- Surface Mount
Product Environmental Compliance
- EU ELV
- Not Relevant
- EU RoHS
- Not Reviewed
- REACH SVHC
- Not Contained Per -ED/01/2017 (12 January 2017)
- Low-Halogen Status
- Not Low-Halogen