MOLEX

877592083

Milli-Grid Header, Surface Mount, Vertical, 20 Circuits, 2.54µm Tin (Sn) Plating, without Peg, Embossed Tape on reel, Lead-Free
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Additional Information

Part Number
877592083

Reference - Drawing Numbers

Application Specification
503940001-AS-000
Packaging Specification
PK-89990-484-001
Product Specification
PS-87761-100-001
Sales Drawing
SD-87759-277-001

Solder Process Data

Duration at Max. Process Temperature (seconds)
010
Lead-freeProcess Capability
REFLOW
Max. Cycles at Max. Process Temperature
003
Process Temperature max. C
260

Agency Certification

UL
E29179

Electrical

Current - Maximum per Contact
2.0A
Voltage - Maximum
125V

Physical

Breakaway
Yes
Circuits (Loaded)
20
Circuits (maximum)
20
Color - Resin
Black
Durability (mating cycles max)
100
First Mate / Last Break
No
Flammability
94V-0
Glow-Wire Capable
No
Guide to Mating Part
No
Keying to Mating Part
None
Lock to Mating Part
None
Mated Height
3.20mm
Material - Metal
Copper Alloy
Material - Plating Mating
Tin
Material - Plating Termination
Tin
Material - Resin
Nylon
Net Weight
0.593/g
Number of Rows
2
Orientation
Vertical
PCB Locator
No
PCB Retention
None
Packaging Type
Embossed Tape on Reel
Pitch - Mating Interface
2.00mm
Pitch - Termination Interface
2.00mm
Plating min - Mating
2.540µm
Plating min - Termination
1.270µm
Polarized to Mating Part
No
Polarized to PCB
No
Robotic Placement
Pick and Place Cap
Shrouded
No
Stackable
No
Temperature Range - Operating
-55° to +105°C
Termination Interface: Style
Surface Mount

Product Environmental Compliance

EU ELV
Not Relevant
EU RoHS
Not Reviewed
REACH SVHC
Not Contained Per -ED/01/2017 (12 January 2017)
Low-Halogen Status
Not Low-Halogen

Documents

Data Sheet

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