877624007

Milli-Grid Header, Dual Row Dual Body, Surface Mount, Vertical, 40 Circuits, 0.38µm Gold (Au) Selective Plating, 11.60mm Stacking Height, with Pick-and-Place Cap, without Peg, Embossed Tape on Reel Packaging, Lead-Free
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Reference - Drawing Numbers

Application Specification
503940001-AS-000
Packaging Specification
PK-151033-0001-001, PK-87858-300-000, PK-89990-475-001, PK-89990-476-001, PK-89990-484-001, PK-89990-485-001, PK-89990-487-001
Product Specification
PS-87761-100-001
Sales Drawing
SD-87762-175-001
Test Summary
877610000-TS-000

Solder Process Data

Duration at Max. Process Temperature (seconds)
010
Lead-freeProcess Capability
REFLOW
Max. Cycles at Max. Process Temperature
003
Process Temperature max. C
260

Electrical

Current - Maximum per Contact
2.0A
Voltage - Maximum
125V

Physical

Breakaway
Yes
Circuits (Loaded)
40
Circuits (maximum)
40
Color - Resin
Black
First Mate / Last Break
No
Glow-Wire Capable
No
Guide to Mating Part
No
Keying to Mating Part
None
Lock to Mating Part
None
Mated Height
4.40mm
Material - Metal
Copper Alloy
Material - Plating Mating
Gold
Material - Plating Termination
Tin
Material - Resin
Nylon
Net Weight
2.086/g
Number of Rows
2
Orientation
Vertical
PCB Locator
No
PCB Retention
None
Packaging Type
Embossed Tape on Reel
Pitch - Mating Interface
2.00mm
Pitch - Termination Interface
2.00mm
Plating min - Mating
0.381µm
Plating min - Termination
2.032µm
Polarized to Mating Part
No
Polarized to PCB
No
Robotic Placement
Pick and Place Cap
Shrouded
No
Stackable
No
Temperature Range - Operating
-55° to +105°C
Termination Interface: Style
Surface Mount

Product Environmental Compliance

EU ELV
Not Relevant
EU RoHS
Not Reviewed
REACH SVHC
Not Contained Per -ED/30/2017 (7 July 2017)
Low-Halogen Status
Not Low-Halogen

Documents

Data Sheet

Download

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