878313021

2.00mm Pitch, Milli-Grid PCB Header, Dual Row, Vertical, Through Hole, Shrouded, 30 Circuits, 0.76µm Gold (Au) Plating, with Center Polarization Slot, with Locking Window, without PCB Locator, Tube
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Reference - Drawing Numbers

Application Specification
503940001-AS-000
Packaging Specification
PK-87831-001-001
Product Specification
PS-87831-027-001
Sales Drawing
SD-87831-0001-001

Solder Process Data

Duration at Max. Process Temperature (seconds)
010
Lead-freeProcess Capability
WAVE
Max. Cycles at Max. Process Temperature
001
Process Temperature max. C
260

Agency Certification

CSA
LR19980
UL
E29179

Electrical

Current - Maximum per Contact
2.0A
Voltage - Maximum
125V

Physical

Breakaway
No
Circuits (Loaded)
30
Circuits (maximum)
30
Color - Resin
Black
Durability (mating cycles max)
100
First Mate / Last Break
No
Flammability
94V-0
Glow-Wire Capable
No
Guide to Mating Part
No
Keying to Mating Part
None
Lock to Mating Part
Yes
Material - Metal
Phosphor Bronze
Material - Plating Mating
Gold
Material - Plating Termination
Tin
Material - Resin
Nylon
Net Weight
1.332/g
Number of Rows
2
Orientation
Vertical
PC Tail Length
2.50mm
PCB Locator
No
PCB Retention
None
PCB Thickness - Recommended
1.60mm
Packaging Type
Tube
Pitch - Mating Interface
2.00mm
Pitch - Termination Interface
2.00mm
Plating min - Mating
0.762µm
Plating min - Termination
1.905µm
Polarized to PCB
No
Shrouded
Yes
Stackable
No
Surface Mount Compatible (SMC)
Yes
Temperature Range - Operating
-55° to +105°C
Termination Interface: Style
Through Hole

Product Environmental Compliance

EU ELV
Not Relevant
EU RoHS
Compliant
REACH SVHC
Not Contained Per -D(2020)9139-DC (19 Jan 2021)
Low-Halogen Status
Not Low-Halogen

Documents

Data Sheet

Download

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